Abstract:With the development of ultra-large scale integrated circuits, ruthenium has been used as one of the most promising barrier materials for copper interconnects by replacing the conventional Ta/TaN bilayer film. However, during the polishing process of Ru/Cu structure using KIO4 slurries, the galvanic corrosion of copper could happen due to the large difference of the corrosion potentials between ruthenium and copper. This paper investigates the galvanic corrosion of copper of the Ru/Cu galvanic couple in KIO4-based slurries. The results reveal that, in KIO4 slurries without the addition of effective inhibitors, the galvanic corrosion of copper can greatly accelerate the oxidation and the corrosion of copper, and as a result, more reaction products, such as Cu(IO4)2/Cu(IO3)2 and CuO, can be rapidly formed on the copper surface, by which the material removal rate (MRR) of copper increases and the defects of copper could be aggravated. According to the theory of galvanic corrosion, two types of methods for controlling the galvanic corrosion of copper are proposed, i.e. the 1st one is using other oxidizer instead and the 2nd one is adding appropriate inhibitors. For the 1st method, KIO3 is used for demonstration and the effectiveness is verified. For the 2nd method, the combination of benzotriazole (BTA) and a non-ionic surfactant is tested. With the addition of BTA and the non-ionic surfactant, the theoretical galvanic current density decreases by one order of magnitude, and the MRR of copper slightly decreases after copper is connected to ruthenium to form a Ru/Cu galvanic couple. The passivation mechanism of BTA and the non-ionic surfactant on the copper surface can be proposed as follows: firstly the added BTA can form hydrophobic Cu-BTA complex on the copper surface; then the hydrophobic polypropylene oxide segments of the non-ionic surfactant can be effectively absorbed on the hydrophobic Cu-BTA complex as a supplement. These two parts are integrated as a complete passivating film on the copper surface to protect it from corrosion and excessive mechanical abrasion.

Micro-galvanic Corrosion of Cu/Ru Couple in Potassium Periodate (KIO 4 ) Solution

Kinetic Analysis on Anodic Polarization Behavior of Nanocrystalline Copper in Na2SO4 Solution

Electrochemical Corrosion Behavior of Bulk Nanocrystalline Copper in Nitric Acid Solution

Galvanic Corrosion Inhibitors for Cu/Ru Couple During Chemical Mechanical Polishing of Ru

Reaction-induced Iodine Adsorption on Cu Surfaces Facilitates Electrocatalytic CO2 Reduction.

Investigation on the Galvanic Corrosion of Copper During Chemical Mechanical Polishing of Ruthenium Barrier Layer

Understanding Oxidation State of Cu-based Catalysts for Electrocatalytic CO2 Reduction

Corrosion Investigations of Ruthenium in Potassium Periodate Solutions Relevant for Chemical Mechanical Polishing

A study of hot corrosion behavior of Cu in molten (Li,K)2CO3

Ruthenium and Copper CMP in periodate-based slurry with BTA and K2MoO4 as compound corrosion inhibitors

Effects of KIO 4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium

A STUDY OF HOT CORROSION BEHMIOR OF Cu IN MOLTEN (Li,k)_2co_3

Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry

From Micro-Environments to Macroscopic Effects: How the Alkaline Hydrogen Evolution Reaction Drives Cu Cathodic Corrosion

Effect of CuI Layer on Photoelectrochemistry of Cu2O Films

Corrosion Electrochemical Kinetic Study of Copper in Acidic Solution Using Scanning Electrochemical Microscopy

Time-varying electrochemically heterogeneous entities during the micro-galvanic corrosion associated with nanoscale precipitates in an Al-Cu-Li alloy

Photocorrosion behavior of Cu2O nanowires during photoelectrochemical CO2 reduction

Effect of Supporting Anion for Copper Corrosion in Gas Diffusion Microenvironments

Potassium persulfate as an oxidizer in chemical mechanical polishing slurries relevant for copper interconnects with cobalt barrier layers

Electrochemical Behavior of Potassium Ferricyanide in Aqueous and (w/o) Microemulsion Systems in the Presence of Dispersed Nickel Nanoparticles