Abstract:Abstract During copper CMP, abrasives and asperities interact with the copper at the nano-scale, partially removing protective films. The local Cu oxidation rate increases, then decays with time as the protective film reforms. In order to estimate the copper removal rate and other Cu-CMP output parameters with a mechanistic model, the passivation kinetics of Cu, i.e. the decay of the oxidation current with time after an abrasive/copper interaction, are needed. For the first time in studying Cu-CMP, microelectrodes were used to reduce interference from capacitive charging, IR drops and low diffusion limited currents, problems typical with traditional macroelectrodes. Electrochemical impedance spectroscopy (EIS) was used to obtain the equivalent circuit elements associated with different electrochemical phenomena (capacitive, kinetics, diffusion etc.) at different polarization potentials. These circuit elements were used to interpret potential-step chronoamperometry results in inhibiting and passivating solutions, notably to distinguish between capacitive charging and Faradaic currents. Chronoamperometry of Cu in acidic aqueous glycine solution containing the corrosion inhibitor benzotriazole (BTA) displayed a very consistent current decay behavior at all potentials, indicating that the rate of current decay was controlled by diffusion of BTA to the surface. In basic aqueous glycine solution, Cu (which undergoes passivation by a mechanism similar to that operating in weakly acidic hydrogen peroxide slurries) displayed similar chronoamperometric behavior for the first second or so at all anodic potentials. Thereafter, the current densities at active potentials settled to values around those expected from polarization curves, whereas the current densities at passive potentials continued to decline. Oxidized Cu species typically formed at ‘active’ potentials were found to cause significant current decay at active potentials and at passive potentials before more protective passive films form. This was established from galvanostatic experiments.

Corrosion Electrochemical Kinetic Study of Copper in Acidic Solution Using Scanning Electrochemical Microscopy

Kinetic Analysis on Anodic Polarization Behavior of Nanocrystalline Copper in Na2SO4 Solution

Electrochemical Corrosion Behavior of Bulk Nanocrystalline Copper in Nitric Acid Solution

Separation and Kinetic Study of Iron Corrosion in Acidic Solution Via a Modified Tip Generation/substrate Collection Mode by SECM

Electrochemical Corrosion Behavior and Surface Passivation of Bulk Nanocrystalline Copper in Alkaline Solution

From Micro-Environments to Macroscopic Effects: How the Alkaline Hydrogen Evolution Reaction Drives Cu Cathodic Corrosion

Corrosion Behavior of Pure Mg Based on Generation/Collection and Feedback Modes of Scanning Electrochemical Microscopy

Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents

Electrokinetic and in Situ Spectroscopic Investigations of CO Electrochemical Reduction on Copper.

Effect of Supporting Anion for Copper Corrosion in Gas Diffusion Microenvironments

Developing micro-kinetic model for electrocatalytic reduction of carbon dioxide on copper electrode

Rate Controlling Reactions for Copper Corrosion in Anaerobic Aqueous Sulphide Solutions

Study on the Initial Atmospheric Corrosion Behavior of Copper in Chloride-Containing Environments

A study of hot corrosion behavior of Cu in molten (Li,K)2CO3

The Study of the H2O2 During Oxygen Reduction Process on Typically Corroding Metal Surface Using Tip Generation-Substrate Collection Mode of SECM

The Influences of Traces of Oxygen and Sulfide on the Corrosion of Copper in Concentrated Chloride Solutions

A STUDY OF HOT CORROSION BEHMIOR OF Cu IN MOLTEN (Li,k)_2co_3

Corrosion Characteristics of Copper in Magnetized Sea Water

Quantitative Interpretation of Potentiodynamic Polarization Curves Obtained at High Scan Rates in Scanning Electrochemical Cell Microscopy

Electrochemical Investigation of Tetrazolium Violet As a Novel Copper Corrosion Inhibitor in an Acid Environment

Electrochemical Investigation of Dynamic Interfacial Processes at 1-Octadecanethiol-modified Copper Electrodes in Halide-Containing Solutions