Abstract:Printing of electrical circuits and interconnects using isotropic conductive adhesives (ICAs) is of great interest due to their low-temperature processing and compatibility with substrates for applications in sensors, healthcare, and flexible devices. As a lower cost alternative to silver (Ag), copper (Cu)-filled ICAs are desirable but limited by the formation of high-resistivity Cu surface oxides. To overcome this limitation, self-assembled monolayers (SAMs) of octadecanethiol (ODT) have been demonstrated to reduce the oxidation of micrometer-scale Cu powder particles for use in ICAs. However, the deposition and function of the SAM require further investigation, as described in this paper. As part of this work, the stages of the SAM deposition process, which included etching with hydrochloric acid to remove pre-existing oxides, were studied using X-ray photoelectron spectroscopy (XPS), which showed low levels of subsequent Cu oxidation when ODT coated. The treated Cu powders were combined with one- or two-part epoxy resins to make Cu-ICAs, and the effect of the Cu surface condition and weight loading on electrical conductivity was examined. When thermally cured in an inert argon atmosphere, ICAs filled with Cu protected by ODT achieved electrical conductivity up to 20 × 105 S·m-1, comparable to Ag-ICAs, and were used to make a functional circuit. To understand the function of the SAM in these Cu-ICAs, scanning and transmission electron microscopy were used to examine the internal micro- and nano-structures along with the elemental distribution at the interfaces within sections taken from cured samples. Sulfur (S), indicative of the ODT, was still detected at the internal polymer-metal interface after curing, and particle-to-particle contacts were also examined. XPS also identified S on the surface of cured Cu-ICAs even after thermal treatment. Based on the observations, electrical contact and conduction mechanisms for these Cu-filled ICAs are proposed and discussed.

Electrochemical Investigation of Dynamic Interfacial Processes at 1-Octadecanethiol-modified Copper Electrodes in Halide-Containing Solutions

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Electrochemical Studies on Self-Assembled Monolayer (sam) Upon Exposure to Anionic Surfactants: Pfoa, Pfos, Sds and Sdbs

Inhibition of Copper Corrosion in Sodium Chloride Solution by the Self-Assembled Monolayer of Sodium Diethyldithiocarbamate

Self-assembled monolayer of ammonium pyrrolidine dithiocarbamate on copper detected using electrochemical methods, surface enhanced Raman scattering and quantum chemistry calculations

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

Electrochemical Corrosion and Protection of Copper Foil Treated by Surface Siloxane Filming

The Electrochemical Apparent Effective Thickness of Alkanethiol Self_Assembled Monolayers

Experimental and Computational Investigation of Salicylhydroxamic Acid as a Corrosion Inhibitor for Copper in Alkaline Solutions

ELECTROCHEMICAL, DFT AND MULTISCALE SIMULATION STUDIES ON SELF-ASSEMBLED FILMS OF 2-AMINO-4-METHYL-PYRIDINE INHIBITOR FOR COPPER METAL CORROSION PROTECTION IN 3.5% NaCl MEDIUM

In Situ Click-Assembling Monolayers on Copper Surface with Enhanced Corrosion Resistance

Electrochemical impedance spectroscopy and Raman spectroscopy studies on electrochemical interface between Au(111) electrode and ethaline deep eutectic solvent

Inhibition of copper corrosion by self-assembled monolayers of triazole derivative in chloride-containing solution

Effect of electrolytes on the electrochemical behaviour of 11-(ferrocenylcarbonyloxy)undecanethiol SAMs on gold disk electrodes

Analysis of Electrochemical Impedance and XRD Spectroscopy for Complex Self-Assembled Film on Silver

On the role of halides and thiols in additive-assisted copper electroplating

Complementary electrochemical ICP-MS flow cell and in-situ AFM study of the anodic desorption of molecular adhesion promotors

Electrochemical Studies of the Alkanethiols Film Adsorbed on Gold in the Solution of K3Fe(CN)6/K4Fe(CN)6

Investigation on the electrochemical evolution of the Cu-sn-Pb ternary alloy covered with CuCl in a simulated atmospheric environment

Electrodeposition and characterization of Zn–Sn alloy coatings from a deep eutectic solvent based on choline chloride for corrosion protection

Self-Assembly of Alkanethiols on an Oxide-Free Surface of a Copper Electrode from Alkaline Solutions under Electrochemical Control