Abstract:Copper is used in a variety of capacities in the development of renewable energy technologies, including as a catalyst on gas diffusion electrodes in electrochemical devices such as CO 2 reduction devices. By gaining a better understanding of Cu corrosion, we can learn more about the durability of devices that utilize copper. However, there are a myriad of factors that influence the kinetics of metal corrosion and deposition, which increases the difficulty to precisely analyze the fundamentals. Factors of concern include adsorbing/desorbing multiple layers of metal, uneven surfaces, defects on the electrode surface, and changes in electrode crystal facets. To mitigate these factors, obtain a more representative picture of Cu corrosion, and investigate the effect of the anions on copper, we created three model systems by employing copper underpotential deposition (UPD) on a single-crystalline Au[111] surface: 1) a phenomenal model system in sulfuric acid; 2) a bridging environment (methane sulfonic acid); and 3) a model microenvironment for gas diffusion (Nafion electrolyte). As a result, a loss in peak sharpness, as well as an increase in the number of peaks that are less resolved were observed in phenomenal and bridging environment, respectively, and a loss in ordered monolayers was seen in model microenvironment. Surprisingly, sulfuric acid and methane sulfonic acid have similar charges passed indicating the same amount of copper is deposited and stripped, whereas much less charge is passed in Nafion, demonstrating that small changes to the supporting anion can have a large effect on Cu UPD structure. As the real world does not exist in a model system, our model microenvironment will provide a better image of Cu corrosion fundamentals in a gas diffusion electrode, which is critical for electrochemical devices application. Figure 1

Electrochemical Corrosion Behavior of Bulk Nanocrystalline Copper in Nitric Acid Solution

Electrochemical corrosion behavior of nanocrystalline copper bulk

Electrochemical Corrosion Behavior and Surface Passivation of Bulk Nanocrystalline Copper in Alkaline Solution

Corrosion Behavior of Bulk Nanocrystalline Copper in Ammonia Solution

Effect of Grain Size on Corrosion of Nanocrystalline Copper in NaOH Solution

Preparation and electrochemical corrosion behaviour of 3D large-sized nanocrystalline copper bulk in solutions with chloride ions

Effect of Sulfate Ions on Anodic Polarization Behavior of Nanocrystalline Copper Bulk

Kinetic Analysis on Anodic Polarization Behavior of Nanocrystalline Copper in Na2SO4 Solution

Electrochemical behaviors and influence factors of copper and copper alloys cathode for electrocatalytic nitrate removal

Nanoscale Intergranular Corrosion and Relation With Grain Boundary Character as Studied In Situ on Copper

Nanotwinned Microstructure Engineering of Electroplated Copper for Enhanced Anti-corrosion in Alkaline Medium

Influence of UV light irradiation on the corrosion behavior of electrodeposited Ni and Cu nanocrystalline foils

Influence of cryogenic impacting and succeeding annealing on electrochemical corrosion behavior of coarse-grain Cu bulk in sodium chloride solution

The Electrochemical Response of Single Crystalline Copper Nanowires to Atmospheric Air and Aqueous Solution

Electrochemical Impedance Spectra for the Corrosion of Porous Cu-35mass%Ni-(5,10)mass%Cr Alloys in Molten (0.62li,0.38k)2co3 at 650 °C in Air

Unveiling Corrosion Pathways of Sn Nanocrystals through High-Resolution Liquid Cell Electron Microscopy

Comparison of Corrosion Behavior Between Coarse Grained and Nanocrystalline Ni Fe Alloys in Chloride Solutions and Proton Exchange Membrane Fuel Cell Environment by EIS, XPS and Raman Spectra Techniques

Porosity evolution and oxide formation in bulk nanoporous copper dealloyed from a copper-manganese alloy studied by in situ resistometry

Microstructure and Corrosion Behavior of Electrodeposited Nickel Prepared from a Sulphamate Bath

Electrochemical behavior and electro-crystallization mechanism of Cu-Ni/Nano-Al 2 O 3 coating with a deposition current density dependence

Effect of Supporting Anion for Copper Corrosion in Gas Diffusion Microenvironments