Abstract:With the development of ultra-large scale integrated circuits, ruthenium has been used as one of the most promising barrier materials for copper interconnects by replacing the conventional Ta/TaN bilayer film. However, during the polishing process of Ru/Cu structure using KIO4 slurries, the galvanic corrosion of copper could happen due to the large difference of the corrosion potentials between ruthenium and copper. This paper investigates the galvanic corrosion of copper of the Ru/Cu galvanic couple in KIO4-based slurries. The results reveal that, in KIO4 slurries without the addition of effective inhibitors, the galvanic corrosion of copper can greatly accelerate the oxidation and the corrosion of copper, and as a result, more reaction products, such as Cu(IO4)2/Cu(IO3)2 and CuO, can be rapidly formed on the copper surface, by which the material removal rate (MRR) of copper increases and the defects of copper could be aggravated. According to the theory of galvanic corrosion, two types of methods for controlling the galvanic corrosion of copper are proposed, i.e. the 1st one is using other oxidizer instead and the 2nd one is adding appropriate inhibitors. For the 1st method, KIO3 is used for demonstration and the effectiveness is verified. For the 2nd method, the combination of benzotriazole (BTA) and a non-ionic surfactant is tested. With the addition of BTA and the non-ionic surfactant, the theoretical galvanic current density decreases by one order of magnitude, and the MRR of copper slightly decreases after copper is connected to ruthenium to form a Ru/Cu galvanic couple. The passivation mechanism of BTA and the non-ionic surfactant on the copper surface can be proposed as follows: firstly the added BTA can form hydrophobic Cu-BTA complex on the copper surface; then the hydrophobic polypropylene oxide segments of the non-ionic surfactant can be effectively absorbed on the hydrophobic Cu-BTA complex as a supplement. These two parts are integrated as a complete passivating film on the copper surface to protect it from corrosion and excessive mechanical abrasion.

Ruthenium and Copper CMP in periodate-based slurry with BTA and K2MoO4 as compound corrosion inhibitors

Investigation on the Galvanic Corrosion of Copper During Chemical Mechanical Polishing of Ruthenium Barrier Layer

Galvanic Corrosion Inhibitors for Cu/Ru Couple During Chemical Mechanical Polishing of Ru

Corrosion Investigations of Ruthenium in Potassium Periodate Solutions Relevant for Chemical Mechanical Polishing

Electrolyte Composition and Galvanic Corrosion for Ruthenium/copper Electrochemical Mechanical Polishing

Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning

Effects of KIO 4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium

Effect of Potassium Ferrocyanide on CMP Performance of Ruthenium in H 2 O 2 -based Slurries

Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry

Synergetic effect of benzotriazole and non-ionic surfactant on copper chemical mechanical polishing in KIO 4 -based slurries

The Cmp Effect Of Potassium Molybdate With Bta As Compound Corrosion Inhibitor Used In Cmp Of The Tsv Heterogeneous Microstructure

Effect of ionic strength on ruthenium CMP in H 2 O 2 -based slurries

Surface Characteristics of Ruthenium in Periodate-Based Slurry During Chemical Mechanical Polishing

Electrochemical Corrosion Behavior and Theoretical Simulation of Cobalt in Chemical Mechanical Polishing Process

Effect of Guanidine Sulfate on the CMP of Ru in H2O2 Based Slurry

Effect of Corrosion Inhibitor and Non-ionic Surfactant on CMP of Cu/Co Barrier Stack

Tribo-Electrochemical Characterization of Ru, Ta and Cu CMP Systems Using Percarbonate Based Solutions

Effect of ethylenediamine on CMP performance of ruthenium in H2O2-based slurries

Mechanisms of Mixed Corrosion Inhibitors in Copper Chemical Mechanical Polishing

Experimental and Density Functional Theory Study of Inhibitors on Cobalt Corrosion for Chemical Mechanical Planarization Process

Characterization of 1, 2, 4-Triazole as Corrosion Inhibitor for Chemical Mechanical Polishing of Cobalt in H2O2 Based Acid Slurry