Abstract:Compared with traditional switches, RF MEMS switches are characterized by low power consumption, low insertion loss, high isolation, good linearity and high integration. However, the high cost of packaging process has great impact on the device performance among the RF MEMS processing. This paper overviews the research status of RF MEMS switch, such as the structural design, the wafer-level packaging. The review will focus on the wafer-level packaging of RF MEMS switch and the following conclusions are drawn by comparing the different methods of wafer level packaging: 1) The packaging of RF MEMS switches mainly adopts WLP methods, which are divided into two types, cap packaging and thin film packaging. Thin film packaging is more promising due to it presenting a lower temperature than cap packaging. 2) The low temperature bonding technology is used in the cap packaging for RF MEMS switch, and the cap packaging has gradually matured. 3) The sacrificial layer release technique is needed in the thin film packaging, and the contamination problem caused by clean technology in the packaging process still needs to be solved. 4) As cap materials or sealing ring materials, polymer is a low-temperature encapsulation material, which has great development potential. But, it is too sensitive to humidity, and it still need a deeper study. The reviews are presented to get a better understanding of the state of the art work done in the field RF-MEMS package for nearly past twenty years.

Developing RF MEMS Switches Technology

Rf Mems Switch and Its Applications

Intermodulation Distortion in MEMS Capacitive Switches under High RF Power

Rf Mems Activities at Imetu

Research Status and Development Trend of MEMS Switches: A Review

Novel Process for Fabrication of RF MEMS Switch with High Mechanical Reliability

Electro-thermally actuated RF MEMS switch for wireless communication.

Research status of wafer level packaging for RF MEMS switches

An Ultra-Broadband Contact-Capacitive RF MEMS Switch for 15-110GHZ Applications

Design of A Novel Bulk Micro-Machined Rf Mems Switch

Design and Fabrication of DC to 30 GHz DC-contact Shunt RF MEMS Switch

Design and fabrication of X-band capacitive MEMS switches

Novel design and analysis of RF MEMS shunt capacitive switch for radar and satellite communications

Design of Broadband High-Frequency Multi-Throw RF-MEMS Switches

Design, optimization and simulation of a low-voltage shunt capacitive RF-MEMS switch

Design and Fabrication of a Capacitive Series RF MEMS Switch

RF MEMS-CMOS Device Integration: An Overview of the Potential for RF Researchers

A Low-Voltage Lateral MEMS Switch with High RF Performance

An Advanced Real Time Lead RF-MEMS Based Switch Design for AI Applications

Design and Fabrication of a Low Insertion Loss Capacitive RF MEMS Switch with Novel Micro-Structures for Actuation

Capacitive Rf MEMS Switch with Composite Beam