Improving Performance of the Metal-to-metal Contact RF MEMS Switch with a Pt–Au Microspring Contact Design
Bo Liu,Zhiqiu Lv,Xunjun He,Meng Liu,Yilong Hao,Zhihong Li
DOI: https://doi.org/10.1088/0960-1317/21/6/065038
2011-01-01
Journal of Micromechanics and Microengineering
Abstract:Performances of the metal-to-metal contact radio frequency (RF) MEMS switches largely rely on the contacts. A novel contact employing the microspring structure is demonstrated in this paper. The microspring contact can achieve a stable contact at lower actuation voltage, alleviating mechanical wear on the contacts, and can effectively increase the fabrication tolerance. An in-line Pt-Au microspring contact switch was fabricated and characterized. To evaluate the improvement in performance, the results were compared with those of the Au-Au solid contact switch without a microspring design. The highest current handled by the Pt-Au microspring contact was 150 mA per contact, whereas only 20 mA was handled by the Au-Au solid contact. The insertion loss of the Pt-Au microspring contact switch was -0.2 dB at 20 GHz, which was comparable with that of the Au-Au solid contact switch. The isolation of the Pt-Au microspring contact switch was -22 dB at 20 GHz, and that of the Au-Au solid contact switch was -18 dB. With the Pt-Au microspring contact, the switch exceeds its power handling ability and reliability with comparable RF performances.