Abstract:Copper (Cu) is used in integrated circuits and microdevices and has the potential to replace aluminum alloys due to its low resistivity, strong electromigration properties, and affordability. However, a significant factor that influences the performance of devices at the micro and nano scales is the surface roughness of the deposits. LAMMPS software is employed to simulate the deposition Cu on an ideal state for a stainless-steel substrate. The deposition process and deformation behavior of Cu on the surface and the roughness of the deposition surface is analyzed. Taking the deposition process of Cu atoms as an object, the effects of different atomic numbers, different temperatures, different velocities, and different heights on the surface roughness of the deposits were investigated. The atomic structure composition of the deposition velocity is analyzed, and the radial distribution function is analyzed to reveal the microscopic mechanism of action. The results of the theoretical deposition and analysis show that the surface roughness increases with the number of atoms deposited and decreases with increasing substrate temperature. The surface roughness first decreases and then, after some fluctuation, stays constant at a particular level with increasing velocity. Additionally, as the deposition height increases, the surface roughness reduces. There is a nonlinear relationship between the various components and the deposited surface roughness. The surface quality of deposits can be improved during the deposition process by optimizing the deposition parameters of deposition atoms, substrate temperature, deposition velocity, and deposition height.

Effects of Normal Stress, Surface Roughness, and Initial Grain Size on the Microstructure of Copper Subjected to Platen Friction Sliding Deformation

Effect of cryogenic impact deformation and subsequent annealing on microstructure and microhardness of pure copper

Microstructural evolution of pure copper subjected to friction sliding deformation at room temperature

Microstructure and fretting wear behaviour of gradient-structured Cu sheets prepared by plastic flow machining

An investigation of the combined size and rate effects on the mechanical responses of FCC metals

Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper

A Gradient Nanostructure Generated in Pure Copper by Platen Friction Sliding Deformation

Plastic strain-induced grain refinement at the nanometer scale in copper

Variations in strain affect friction and microstructure evolution in copper under a reciprocating tribological load

Microstructure evolution and anti-wear mechanism of Cu film fabricated by magnetron sputtering deposition

Effects of residual stress on the mechanical properties of copper processed using ultrasonic-nanocrystalline surface modification

Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip

Microstructure evolution in Cu-2.13Fe-0.026P (wt%): The contribution of texture intensity to residual stress variation

Strain effects on the wear rate of severely deformed copper

Influence of surface burnishing process with single strain path and reciprocating strain path on copper wear behavior

Microstructure and Texture of Pure Copper under Large Compression Deformation and Different Annealing Times

Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Orientation-dependent plastic flow in nanoscratching of copper surfaces

Impurity effect on recrystallization and grain growth in severe plastically deformed copper

Effect of stacking fault energy on deformation mechanisms in Cu and Cu-30% Zn alloy with gradient structure obtained by SMAT

Molecular dynamics simulations and analyzation of Cu deposited on stainless steel substrate surfaces