Abstract:When the grain size is below a critical value, the deformation mechanism of nanocrystalline (NC) metal shifts from dislocation- to grain boundaries (GBs)-mediated activities. However, GB activities including deformation and rotation in the elastic and plastic stages have not given detailed analysis because of the limitation of current experimental techniques, as well as the unrealistic model with regular boundaries in most molecular dynamics (MD) simulation reducing the activities. To quantitatively analyze GB activities, we recently developed an algorithm based on moving least-squares interpolant. Besides, the phase field model was used to build the nanocrystalline (NC) Cu with more natural GBs for MD tensile simulation. The results of temperature dependence of Young's modulus (E), strain rate sensitivity (SRS), and variation of stress at GBs (σGB) and at grain interiors (σGI) are in good agreement with previous researches. In the elastic stage, the σGB fluctuates in a larger range than σGI. The vibrated σGB is the results of micro-elastic and micro-plastic deformation of GBs and the increased stage of σGB in one cycle can lead to increasing the σGI. Thus, the temperature dependence of E is affected by the frequency of vibrated σGB at relative low temperatures (T ≤ 450 K). The E is strain rate independent because of the same vibration of σGB. In the plastic stage, the flow stress strongly depends on the size of twinning boundaries (TBs) structures. The fraction of GB activities improves with increasing temperature and decreasing strain rate. GB activities can attenuate stress concentration on boundaries and then results in the formation and growth mechanism of TB changing from Shockley partial dislocation gliding on adjacent plane of stacking faults (SFs) to GB deformation. Thus, the size of TB at low temperatures and high strain rate is larger than that at the opposite conditions.

Plastic strain-induced grain refinement at the nanometer scale in copper

Effect of cryogenic impact deformation and subsequent annealing on microstructure and microhardness of pure copper

Strain-induced Refinement and Thermal Stability of a Nanocrystalline Steel Produced by Surface Mechanical Attritiontreatment

Achieving High Strength and High Ductility in Nanostructured Metals: Experiment and Modelling

Refining Micron-Sized Grains to Nanoscale in Ni-Co Based Superalloy by Quasistatical Compressive Deformation at High Temperature

Strain Rate Effect on Plastic Deformation of Nanocrystalline Copper Investigated by Molecular Dynamics

Grain Coarsening in Nanocrystalline Copper with Very Small Grain Size During Tensile Deformation

An investigation of the combined size and rate effects on the mechanical responses of FCC metals

Shear strain gradient in Cu/Nb nanolaminates: Strain accommodation and chemical mixing

Grain refinement at the nanoscale via mechanical twinning and dislocation interaction in a nickel-based alloy

An Elastic–viscoplastic Model of Deformation in Nanocrystalline Metals Based on Coupled Mechanisms in Grain Boundaries and Grain Interiors

Influence of grain boundary activites on elastic and plastic deformation of nanocrystalline Cu as studied by phase filed and atomistic simulaiton

Impurity effect on recrystallization and grain growth in severe plastically deformed copper

Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper

Orientation-dependent plastic flow in nanoscratching of copper surfaces

Grain size dependent microstructure and texture evolution during dynamic deformation of nanocrystalline face-centered cubic materials

Local Deformation Mechanisms in Metal Systems with a Tailored Grain Size Distribution

Influence of strain rate and Sn in solid solution on the grain refinement and crystalline defect density in severely deformed Cu

An investigation of slip transmission during uniaxial tensile deformation of a coarse-grained copper via EBSD characterization and crystal plasticity modelling

Molecular Dynamics Simulations of Tensile Deformation of Gradient Nano-Grained Copper Film

Regain Strain-Hardening in High-Strength Metals by Nanofiller Incorporation at Grain Boundaries.