Abstract:Ultrafine grained (UFG) metallic materials arouse a great interest clue to their excellent mechanical properties. The UFG materials, produced by severe plastic deformation (SPD) technique such as channel angular pressing (ECAP) and high pressure torsion (HPT), exhibit obvious improvement in strength but a large decrease in their thermal stability and ductility. In this article; an UFG QBel.7 copper alloy with good comprehensive properties was prepared by multi directional compression (MDC) at room temperature and subsequent annealing at high temperature. The deformed and subsequent annealed microstructures were investigated by OM, TEM and SEM/EBSD techniques. The integrated flow curves plotted over a number of compression passes increase to a. maximum at moderate strains of 1 to 2 followed by steady state like flow at high cumulative strains. Fine grains were not observed even at a higher cumulative stain of Sigma epsilon=4.8, although there were many sub grains when the samples were deformed to Sigma epsilon=2.4. This indicates that the dynamic recrystallization or recovery was completely inhibited by Fine precipitates. Static recrystallization (SRX) of the MDCed structure at 973 K was also investigated. With the increment of cumulative strains, the effect of grain refinement became more obvious, but the thermal stability was getting worse. At a medium strain of Sigma epsilon=2.4, the minimal grain size of 0.8 mu m could be developed with an excellent combination of properties. The formation of ultrafine grains is attributed to the development from low angle boundaries to medium angle boundaries to large angle boundaries. The change of the average grain size with annealing time could be divided into three, stages: a recovery period for grain refinement, rapid grain refinement and normal grain growth.

Impurity effect on recrystallization and grain growth in severe plastically deformed copper

Effect of cryogenic impact deformation and subsequent annealing on microstructure and microhardness of pure copper

Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper

Heterogeneous Structure Controlled by Shear Bands in Partially Recrystallized Nano-Laminated Copper

Dynamic Processes for Nanostructure Development in Cu after Severe Cryogenic Rolling Deformation

Experimental Study on Pure Copper Subjected to Different Severe Plastic Deformation Modes

Impurity-induced microstructural uniformity by narrowing stored energy difference between {111} and {100} grains in rolled W

Breaking the purity-stability dilemma in pure Cu with grain boundary relaxation

Effect of grain refinement on mechanical and electrochemical properties of severely deformed pure copper through equal channel angular pressing

Influence of Crystallite Size and Impurity Density on the Grain Structure Evolution of Electroplated Copper Films During Thermal and Laser Annealing

Effects of Strain Rate on the GND Characteristics of Deformed Polycrystalline Pure Copper

Nanocrystalline Grain Structures Developed in Commercial Purity Cu by Low-Temperature Cold Rolling

Alloying effects on deformation induced microstructure evolution in copper

Microstructure Evolution in High Purity Aluminum Single Crystal Processed by Equal Channel Angular Pressing (ECAP)

Plastic strain-induced grain refinement at the nanometer scale in copper

Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper

Effects of Deformation on Microstructures and Properties of Submicron Crystalline Cu-5%Cr Alloy

Microstructural Evolution and Micro/Meso-Deformation Behavior in Pure Copper Processed by Equal-Channel Angular Pressing

Grain Refinement in Surficial Cryogenic Grinding

Preparation of Ultrafine-Grained Copper Alloy by Annealing Treatment after Multi-Directional Compression

Effect of original microstructure on microstructure and properties of pure copper subjected to equal channel angular pressing(ECAP)