Abstract:The instability of the structure is one of the problems standing in the way of widespread use of submicrocrystalline (SMC) materials. In pure SMC metals there is a relatively low temperature of recrystallization and substantially nonuniform of grain growth at temperatures close to the temperature of recrystallization. Rapid grain growth during heating leads to loss of the unique physical and mechanical properties of the material. In recent years, a large number of works is devoted to the study of the problems influence of modes of ECAP and heating conditions on the structure and properties of metallic materials, and a number of interesting experimental results are obtained. However, the theoretical models explaining regularities of formation and subsequent evolution of the structure of SMC materials by heating and allowing calculate quantitative calculations of the parameters of these processes are developed is not enough. The purpose of this work was to investigate the influence of preliminary thermal treatment on the structure that is formed in copper at ECA-pressing and subsequent heat treatment. Microstructure of copper samples subjected ECA -pressing, change under the action simultaneous influence of two factors: the preliminary heat treatment and increasing the pressing temperature. Minimum average grain size obtained during pressing of alloy M1 is 0.6 microns. This grain size is obtained after quenching at 7000C and ECAP at room temperature and 6 cycles of deformation. The use of preliminary quenching provides a more fine-grained structure as well for the alloy M1 also to reduce hardness by 15%, which helps to reduce the pressing force on the first pass, from 620 to 510 MPa. The use of combined thermomechanical treatment on a "quenching at 7000C ECAP low-tempered at 2000C" for the alloy M1 allows significantly improving the characteristics of copper and increases the resistance emergence and spread of cracks.

Effect of original microstructure on microstructure and properties of pure copper subjected to equal channel angular pressing(ECAP)

Effect of cryogenic impact deformation and subsequent annealing on microstructure and microhardness of pure copper

Tensile Deformation Behaviors of CuNi Alloy Processed by Equal Channel Angular Pressing

Effect of grain refinement on mechanical and electrochemical properties of severely deformed pure copper through equal channel angular pressing

Tensile and Compressive Deformation Behaviors of Commercially Pure Al Processed by Equal-Channel Angular Pressing with Different Dies

Experimental and Numerical Investigation of the ECAP Processed Copper: Microstructural Evolution, Crystallographic Texture and Hardness Homogeneity

Microstructure, texture and mechanical properties of pure copper processed by ECAP and subsequent cold rolling

Microstructure Evolution in High Purity Aluminum Single Crystal Processed by Equal Channel Angular Pressing (ECAP)

Grain Refinement and Strengthening of an Aluminum Alloy Subjected to Severe Plastic Deformation through Equal-Channel Angular Pressing

Effect of the Equal Channel Angular Pressing on the Microstructure and Phase Composition of a 7xxx Series Al-Zn-Mg-Zr Alloy

Ebsp Investigation of Microstructure and Texture Evolution During Equal Channel Angular Pressing of Aluminium

Effect of ECAP on microstructure uniformity and mechanical properties of high purity aluminum

Microstructural evolution and mechanical properties of AZ31 Mg alloy fabricated by a novel bifurcation-equal channel angular pressing

ANALYSIS OF THE MICROSTRUCTURE EVOLUTION OF COPPER AT EQUAL CHANNEL ANGULAR PRESSING

Microstructure evolution and mechanical properties of Cu-3Ag-xZr alloys processed by equal channel angular pressing

Structural Characterization of Binary Al-Cu Alloy Processed by Equal Channel Angular Pressing at Half of the Melting Point

Micro/nanostructure high strength and high conductivity CuCrZr alloy prepared through equal channel angular pressing and aging treatment

Influence of Equal Channel Angular Pressing and Cyclic Extrusion Compression on the Microstructure Evolution and Mechanical Properties of Pure Aluminum

Effect of High Temperature-High Pressure Treatment on Microstructure and Mechanical Properties of Cu-Cr Alloy

Microscopic Analysis by EBSD Method on Fatigue Crack Propagation Behaviour in Ultrafine-Grained Copper

Microstructure Evolution and Cooperative Strengthening Mechanism of Copper–Aluminum Bimetal Continuous Equal Channel Angular Pressing-Annealing Process