Abstract:The instability of the structure is one of the problems standing in the way of widespread use of submicrocrystalline (SMC) materials. In pure SMC metals there is a relatively low temperature of recrystallization and substantially nonuniform of grain growth at temperatures close to the temperature of recrystallization. Rapid grain growth during heating leads to loss of the unique physical and mechanical properties of the material. In recent years, a large number of works is devoted to the study of the problems influence of modes of ECAP and heating conditions on the structure and properties of metallic materials, and a number of interesting experimental results are obtained. However, the theoretical models explaining regularities of formation and subsequent evolution of the structure of SMC materials by heating and allowing calculate quantitative calculations of the parameters of these processes are developed is not enough. The purpose of this work was to investigate the influence of preliminary thermal treatment on the structure that is formed in copper at ECA-pressing and subsequent heat treatment. Microstructure of copper samples subjected ECA -pressing, change under the action simultaneous influence of two factors: the preliminary heat treatment and increasing the pressing temperature. Minimum average grain size obtained during pressing of alloy M1 is 0.6 microns. This grain size is obtained after quenching at 7000C and ECAP at room temperature and 6 cycles of deformation. The use of preliminary quenching provides a more fine-grained structure as well for the alloy M1 also to reduce hardness by 15%, which helps to reduce the pressing force on the first pass, from 620 to 510 MPa. The use of combined thermomechanical treatment on a "quenching at 7000C ECAP low-tempered at 2000C" for the alloy M1 allows significantly improving the characteristics of copper and increases the resistance emergence and spread of cracks.

ANALYSIS OF THE MICROSTRUCTURE EVOLUTION OF COPPER AT EQUAL CHANNEL ANGULAR PRESSING

Experimental and Numerical Investigation of the ECAP Processed Copper: Microstructural Evolution, Crystallographic Texture and Hardness Homogeneity

Tensile Deformation Behaviors of CuNi Alloy Processed by Equal Channel Angular Pressing

Effect of cryogenic impact deformation and subsequent annealing on microstructure and microhardness of pure copper

Effect of grain refinement on mechanical and electrochemical properties of severely deformed pure copper through equal channel angular pressing

Effect of original microstructure on microstructure and properties of pure copper subjected to equal channel angular pressing(ECAP)

Microscopic Analysis by EBSD Method on Fatigue Crack Propagation Behaviour in Ultrafine-Grained Copper

Effect of High Temperature-High Pressure Treatment on Microstructure and Mechanical Properties of Cu-Cr Alloy

Structural Characterization of Binary Al-Cu Alloy Processed by Equal Channel Angular Pressing at Half of the Melting Point

Microstructure Evolution and Cooperative Strengthening Mechanism of Copper–Aluminum Bimetal Continuous Equal Channel Angular Pressing-Annealing Process

Microstructure, texture and mechanical properties of pure copper processed by ECAP and subsequent cold rolling

Investigation of the stress-strain state and microstructure transformation of copper busbars in the deformation zone during continuous extrusion

Eff ects of Diff erent Mechanical Alloying Parameters on Microstructure of High Temperature Nanocrystalline Cu-Ta Alloys

Effect of the Equal Channel Angular Pressing on the Microstructure and Phase Composition of a 7xxx Series Al-Zn-Mg-Zr Alloy

1216 Nano-Scale Strength Analysis by EBSD and AFM Hybrid Method in Ultrafine-Grained Copper Processed by ECAP

Microstructure Refinement Mechanism of Undercooled Cu55Ni45 Alloys

EBSD Analysis of Deformed and Partially Recrystallized Microstructures in ECAE-Processed Copper

Micro/nanostructure high strength and high conductivity CuCrZr alloy prepared through equal channel angular pressing and aging treatment

Effect of Sample Size on Microstructure and Mechanical Properties of OFHC Copper Processed by Equal Channel Angular Pressing

Dynamic Properties of Low-Alloyed Copper Alloys with Submicrocrystalline Structure Obtained by High Strain Rate Deformation

Effect of ECAP temperature on formation of triple heterogeneous microstructure and mechanical properties of Zn–1Cu alloy