Abstract:The instability of the structure is one of the problems standing in the way of widespread use of submicrocrystalline (SMC) materials. In pure SMC metals there is a relatively low temperature of recrystallization and substantially nonuniform of grain growth at temperatures close to the temperature of recrystallization. Rapid grain growth during heating leads to loss of the unique physical and mechanical properties of the material. In recent years, a large number of works is devoted to the study of the problems influence of modes of ECAP and heating conditions on the structure and properties of metallic materials, and a number of interesting experimental results are obtained. However, the theoretical models explaining regularities of formation and subsequent evolution of the structure of SMC materials by heating and allowing calculate quantitative calculations of the parameters of these processes are developed is not enough. The purpose of this work was to investigate the influence of preliminary thermal treatment on the structure that is formed in copper at ECA-pressing and subsequent heat treatment. Microstructure of copper samples subjected ECA -pressing, change under the action simultaneous influence of two factors: the preliminary heat treatment and increasing the pressing temperature. Minimum average grain size obtained during pressing of alloy M1 is 0.6 microns. This grain size is obtained after quenching at 7000C and ECAP at room temperature and 6 cycles of deformation. The use of preliminary quenching provides a more fine-grained structure as well for the alloy M1 also to reduce hardness by 15%, which helps to reduce the pressing force on the first pass, from 620 to 510 MPa. The use of combined thermomechanical treatment on a "quenching at 7000C ECAP low-tempered at 2000C" for the alloy M1 allows significantly improving the characteristics of copper and increases the resistance emergence and spread of cracks.

EBSD Analysis of Deformed and Partially Recrystallized Microstructures in ECAE-Processed Copper

Effect of cryogenic impact deformation and subsequent annealing on microstructure and microhardness of pure copper

Microstructure of ECAE-Processed Copper after Long-Term Room-Temperature Storage

Tensile Deformation Behaviors of CuNi Alloy Processed by Equal Channel Angular Pressing

1216 Nano-Scale Strength Analysis by EBSD and AFM Hybrid Method in Ultrafine-Grained Copper Processed by ECAP

Microscopic Analysis by EBSD Method on Fatigue Crack Propagation Behaviour in Ultrafine-Grained Copper

Experimental and Numerical Investigation of the ECAP Processed Copper: Microstructural Evolution, Crystallographic Texture and Hardness Homogeneity

Heterogeneous Structure Controlled by Shear Bands in Partially Recrystallized Nano-Laminated Copper

Effect of grain refinement on mechanical and electrochemical properties of severely deformed pure copper through equal channel angular pressing

Structural Coarsening During Annealing of an Aluminum Plate Heavily Deformed Using ECAE

EBSD-Based Techniques for Characterization of Microstructural Restoration Processes During Annealing of Metals Deformed to Large Plastic Strains

ANALYSIS OF THE MICROSTRUCTURE EVOLUTION OF COPPER AT EQUAL CHANNEL ANGULAR PRESSING

EBSP Study of the Annealing Behavior of Aluminum Deformed by Equal Channel Angular Processing

Annealing Behavior of Aluminium Deformed by Equal Channel Angular Pressing

Microstructure, texture and mechanical properties of pure copper processed by ECAP and subsequent cold rolling

Influence of Cold Rolling Routes on Mechanical Properties of Copper Subjected to ECAP

Characterization and Influence of Deformation Microstructure Heterogeneity on Recrystallization

Hardness and Texture of Electrolytic Copper Processed by ECAP at Ambient and Warm Temperature

Microstructure and Texture of Pure Copper under Large Compression Deformation and Different Annealing Times

Effect of original microstructure on microstructure and properties of pure copper subjected to equal channel angular pressing(ECAP)

Characterization of microstructural evolution and mechanical properties of Cu-Ni-Cr alloys deformed by ECAP