Abstract:Pure copper is very soft, however, hardening the pure copper with most strengthening mechanisms leads to a significant reduction in electrical conductivity. Grain refinement is a better strengthening mechanism to maintain high enough electrical conductivity. Plastic deformation at room temperature followed by post-annealing is one of the best methods to achieve fine-grained metals and alloys. In this research, the high-temperature annealing behavior of cold-rolled electrolytic tough-pitch (ETP) copper sheets was studied. 90 % asymmetric cold rolling followed by high-temperature post-annealing at 673 K for 1, 2, 5, 10, 30, 60, and 120 min were applied on the copper. The microstructure was significantly changed with increasing annealing time from 1 to 2 min owing to full recrystallization. With increasing the annealing duration, the grain size is increased. The formation of equiaxed grains with a smaller size (∼9 μm) compared to the full-annealed (initial) sample (∼68 μm) is observed after the longest time of post-annealing (120 min) due to the pinning effect of Cu2O particles. The post-annealed copper sheets processed by asymmetric rolling (in this work) exhibited a more homogeneous microstructure through the thickness compared to the symmetric rolling due to more uniform stored strain energy. The results showed that the first deformed grains that undergo recrystallization during post-annealing are Goss-oriented grains. With an increase in the post-annealing time, the S and Copper components were eliminated and a strong Cube and P texture orientations were formed. Interestingly, after 1 min of post-annealing, the yield and tensile strength enhanced to 410.2 MPa and 418.6 MPa owing to the annealing hardening phenomenon. The hardness and strength reached a constant value after the post-annealing for 10 min and above. With increasing the post-annealing duration, the central area of fracture surfaces (consisting of ductile dimples) became larger and the outer region (consisting of flat surfaces and shear dimples) became smaller, showing a shift towards perfect ductile fracture. With the increase of post-annealing time from 1 min to 120 min, the electrical conductivity was increased from 77.6 to 97.5 %IACS. The presence of the Cube texture increased the electron mobility compared to the P orientation, by reducing the mean distance that they can travel without scatter. From the obtained results, it can be concluded that the asymmetric cold rolling followed by high-temperature post-annealing is capable of strength improvement and maintaining electrical conductivity in copper.

Microstructure, texture and mechanical properties of pure copper processed by ECAP and subsequent cold rolling

Influence of Cold Rolling Routes on Mechanical Properties of Copper Subjected to ECAP

Experimental and Numerical Investigation of the ECAP Processed Copper: Microstructural Evolution, Crystallographic Texture and Hardness Homogeneity

An Investigation on Rolling Texture Transition in Copper Preprocessed by Equal Channel Angular Pressing

Effect of grain refinement on mechanical and electrochemical properties of severely deformed pure copper through equal channel angular pressing

Investigation on Grain Size Effect of Rolling Texture in Copper

Effect of original microstructure on microstructure and properties of pure copper subjected to equal channel angular pressing(ECAP)

High-temperature annealing behavior of cold-rolled electrolytic tough-pitch copper

Effect of Cold Rolling on as–ECAP Interstitial Free Steel

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Effect of Single-Pass Rolling on Microstructure and Mechanical Properties of AZ31 Alloy Processed by Equal Channel Angular Pressing

Characterization of microstructural evolution and mechanical properties of Cu-Ni-Cr alloys deformed by ECAP

EFFECT OF DIFFERENT STRAIN ROUTES ON MECHANICAL PROPERTIES AND MICROSTRUCTURE OF COPPER

Microscopic Analysis by EBSD Method on Fatigue Crack Propagation Behaviour in Ultrafine-Grained Copper

Mechanical Properties and Microstructure of Rolled and Electrodeposited Thin Copper Foil

Effect of cryo-rolling on mechanical properties and microstructure of pure copper

Achieving ultra-fine grains and high corrosion resistance of Al-Zn-Mg-Cu alloy by ECAP and post cold rolling

Microstructure and Texture Evolution in Cold-Rolled and Annealed Oxygen-Free Copper Sheets

Influence of ECAP as grain refinement technique on microstructure evolution, mechanical properties and corrosion behavior of pure aluminum

Tensile Deformation Behaviors of CuNi Alloy Processed by Equal Channel Angular Pressing

Low‐Temperature Annealing of Asymmetrically Cold‐Rolled Electrolytic Tough‐Pitch Copper: Anneal Hardening and Bimodal Microstructure