Effect of cryogenic impact deformation and subsequent annealing on microstructure and microhardness of pure copper

wei luo,hailong gong,qiming wang,jiangxu lu,mi yan
DOI: https://doi.org/10.1016/j.matlet.2015.05.150
IF: 3
2015-01-01
Materials Letters
Abstract:This article presents an application of cryogenic impact deformation in effective grain refinement in coarse-grained copper. Ultrafine-grained microstructure was processed by means of cryogenic impact deformation using an air hammer with an initial impact velocity of 7.35ms−1. For strain ε=2.21, TEM observation showed that the initial equiaxed coarse grains (18μm) evolved into a lamellar structure of submicron size narrow domains delineated by low-angle grain boundaries. The microhardness of the deformed sample increased from 74.2±1.2HV to 118.3±1.8HV. Subsequently annealed at 190°C for 60min led to a significant reduction of dislocation density. Elongated ultrafine grains (with a mean width of 175nm) embedded with remaining nanoscale deformation twins were observed in the annealed sample. This study highlights the potential of cryogenic impact deformation to produce bulk ultrafine-grained materials.
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