Microstructural evolution of pure copper subjected to friction sliding deformation at room temperature

s q deng,a godfrey,wangyu liu,c l zhang
DOI: https://doi.org/10.1016/j.msea.2015.05.017
2015-01-01
Abstract:Samples of commercial oxygen-free high conductivity Cu (99.9% purity) have been deformed at room temperature using a rapid platen friction sliding deformation (PFSD) process, under conditions of high friction and relatively large applied load. The microstructural evolution of the surface layers during PFSD over sliding distances from 7mm to 242mm has been characterized and analyzed. The process results in the development of a gradient nanostructure, extending to increasing depths with increasing sliding distance. After a sliding distance of 242mm the microstructure consists of a 15–20µm layer of nanoscale lamellae at the top surface, with a sharp transition to a layer consisting of fine deformed grains, with a smooth transition to deformed material below this. Micro-hardness measurements of the nanoscale lamellae and fine deformed grains reveal values of ≈1.85GPa and 1.2–1.5GPa, respectively. Analysis of the microstructural evolution suggests that the hardening of the surface layers results in a transfer of shear strain to deeper volumes, enhancing the efficiency of the PFSD process.
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