Obtaining Symmetrical Gradient Structure in Copper Wire by Combined Processing
Andrey Volokitin,Irina Volokitina,Mehmet Seref Sonmez,Anastassiya Denissova,Zoya Gelmanova
DOI: https://doi.org/10.3390/sym16111515
2024-11-13
Symmetry
Abstract:Traditionally, structural wire is characterized by a homogeneous microstructure, where the average grain size in different parts of the wire is uniform. According to the classical Hall–Petch relationship, a homogeneous polycrystalline metal can be strengthened by decreasing the average grain size since an increase in the volume fraction of grain boundaries will further impede the motion of dislocations. However, a decrease in the grain size inevitably leads to a decrease in the ductility and deformability of the material due to limited dislocation mobility. Putting a gradient microstructure into the wire has promising potential for overcoming the compromise between strength and ductility. This is proposed a new combined technology in this paper in order to obtain a gradient microstructure. This technology consists of deforming the wire in a rotating equal-channel step die and subsequent traditional drawing. Deformation of copper wire with a diameter of 6.5 mm to a diameter of 5.0 mm was carried out in three passes at room temperature. As a result of such processing, a gradient microstructure with a surface nanostructured layer (grain size ~400 nm) with a gradual increase in grain size towards the center of the wire was obtained. As a result, the microhardness in the surface zone was 1150 MPa, 770 Mpa in the neutral zone, and 685 MPa in the central zone of the wire. Such a symmetrical spread of microhardness, observed over the entire cross-section of the rod, is a direct confirmation of the presence of a gradient microstructure in deformed materials. The strength characteristics of the wire were doubled: the tensile strength increased from 335 MPa to 675 MPa, and the yield strength from 230 MPa to 445 MPa. At the same time, the relative elongation decreased from 20% to 16%, and the relative contraction from 28% to 23%. Despite the fact that the ductility of copper is decreased after cyclic deformation, its values remain at a fairly high level. The validity of all results is confirmed by numerous experiments using a complex of traditional and modern research methods, which include optical, scanning, and transmission microscopy; determination of mechanical properties under tension; and measurement of hardness and electrical resistance. These methods allow reliable interpretation of the fine microstructure of the wire and provide information on its strength, plastic, and electrical properties.
multidisciplinary sciences