The Effect Of Device Electrode Geometry On Performance After Hot-Carrier Stress In Amorphous In-Ga-Zn-O Thin Film Transistors With Different Via-Contact Structures

Liao Po-Yung,Chang Ting-Chang,Chen Yu-Jia,Su Wan-Ching,Chen Bo-Wei,Chen Li-Hui,Hsieh Tien-Yu,Yang Chung-Yi,Chang Kuan-Chang,Zhang Sheng-Dong,Huang Yen-Yu,Chang Hsi-Ming,Chiang Shin-Chuan
DOI: https://doi.org/10.1063/1.4983713
IF: 4
2017-01-01
Applied Physics Letters
Abstract:In this letter, the effects of hot carriers on amorphous In-Ga-Zn-O thin film transistors (TFTs) of different geometric structures were investigated. Three types of via-contact structure TFTs are used in this experiment, defined as source-drain large (SD large), source-drain normal (SD normal), and fork-shaped. After hot-carrier stress, the I-V curves of both SD normal and fork-shaped TFTs with U-shaped drains show a threshold voltage shift along with the parasitic transistor characteristic in the reverse-operation mode. Asymmetrical degradation is exhibited in an ISE-TCAD simulation of the electric field, which shows the distribution of hot electrons injected into the etch-stop layer below the redundant drain electrode. Published by AIP Publishing.
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