Abstract:Thermo-mechanical reliability problem of Cu-filled through silicon via (TSVs) has been considered as one of the crucial issues for TSV application. Due to the coefficient of thermal expansion (CTE) mismatch is large between Cu and the consistent materials, thus free expansion and shrinkage of Cu will be restrained when working temperature changes. The induced thermal stresses, including axial stresses and interfacial shear stresses, will lead to TSV-Cu protrusion. However, lots of problems are still unsettled about Cu protrusion, the observation and analysis of local Cu protrusion phenomenon is an outstanding problem that needs urgent attention. In order to comprehensively investigate the Cu protrusion phenomenon in Cu-filled TSVs, the mechanism of local Cu protrusion needs to be further studied. In this paper, the Cu-filled TSV interposer samples with blind TSV were utilized in heat treatment experiments to analyze Cu protrusion. According to the different heat treatment parameters, seven samples of TSV interposer were selected, one of which was used as the control sample. Using a tube furnace, six TSV interposer samples were heated to different peak temperatures (250 °C, 350 °C and 450 °C) by two heating modes (samples were heated to peak temperatures in furnace with the heating rate of 10°C /min, samples were placed in the furnace after furnace temperature had risen to peak temperatures). The occurrence of global Cu protrusion and local Cu protrusion was related to possible influence factors including thermal stress, grain growth and void formation. This research was expected to help optimizing the structure and technology design of TSVs and further improve thermo-mechanical properties of TSVs.

Fabrication and Traceable Quality Evaluation of Fine Pitch Tsv with Self-Integrated Micro Heater and Thermocouple

Fabrication and Characterization of Fine Pitch TSV Integration with Self-Aligned Backside Insulation Layer Opening.

Thermal-mechanical Reliability Assessment of TSV Structure for 3D IC Integration

Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process

Fabrication and In-Situ Evaluation of Copper TSV Interconnection

Investigate the Microstructure Changes in Cu Through-Silicon Vias (tsvs) under Thermal Process

Thermomechanical Reliability of a Cu-TSV Integration Model Based on 3D Fabrication Processes

Fabrication of Microchannel Embedded Tsv Interposer and Its Influence on Tsv'S Electrical Parameters

Influence of inhomogeneous anisotropic Copper grains in TSV on the thermo-mechanical behaviors in the annealing process

Modeling and Characterization of Joule Heating in Metal Core of Tsv

In Situ Measurement on TSV-Cu Deformation with Hotplate System Based on Sheet Resistance

Fem Simulation of the Thermo-Mechanical Behavior of Tsv 3d Mems Structure

Optimization of thermal loads in TSV fabrication process based on real-time micro deformation process analysis of copper

Investigation of Mechanical Properties of Cu-TSV by Uniaxial Micro-tensile Test

Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias

Failure Analysis Examination of the Effect of Thermal Cycling on Copper-filled TSV Interposer Reliability

Electric-thermo-mechanical Analysis of TSV under High Current Stressing

A Study of the Global and Local Cu Protrusion in Cu-Filled Through Silicon Vias Under Heat Treatment

Thermal and electrical tests of air-gap TSV

Thermal–Mechanical and Signal Reliability of a New Differentiated TSV

Stress Evolution Mechanism and Thermo-Mechanical Reliability Analysis of Copper-Filled TSV Interposer