Abstract:Thermal issue is becoming more and more serious when integrated circuits (IC) further explores along the road of More Moore with dramatic increments of integration degree and power density. Thermal management, including thermal design, modeling, and optimization, has been an important concern in the system-level design of 3D IC. Current thermal modeling for a system level 3D IC design usually relies on a simplified thermal resistance network, which requires trade-offs between the model complexity and the simulation accuracy. Comparing to traditional thermal resistance based model, finite element simulation can provide a more accurate simulation for the thermal management of 3D IC. However, a full chip scale numerical simulation is still lack as an unacceptable huge grid number is unavoidable to deal with the geometric size mismatch existed in a 3D IC. Moreover, current finite element method based numerical simulation tools have no direct supports for the thermal management of 3D IC, since the placement design usually consists a complex data structure from a 3D IC. A method to bridge the finite element method and the 3D IC placement is introduced in this work. The whole bridge process includes placement data structure extraction, 3D IC system model generation, structure, mesh, solver configuration, calculation, and post data analysis. A full chip scale numerical simulation was demonstrated based the present bridge method along with the recently reported equivalent thermal conductivity simplified model.

Fem Simulation of the Thermo-Mechanical Behavior of Tsv 3d Mems Structure

Multi-physics characterization of through silicon vias (TSV) in the presence of a periodic EMP

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Thermal-mechanical Reliability Assessment of TSV Structure for 3D IC Integration

Electrothermal characteristics of carbon-based through-silicon via (TSV) channel

Processes-based Multistep Simulation of Thermal- mechanical Reliability of a 3D-TSV MEMS

Modeling and Characterization of Joule Heating in Metal Core of Tsv

Multiphysics Characterization of Large-Scale Through-Silicon-via Structures

Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-Based 3D MEMS

Comprehensive study of the impact of TSV induced thermo-mechanical stress on 3D IC device performance

Finite Element Stress Analysis Of 3d Tsv Stack Subject To Large Temperature Loading

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

System-Level Analysis of 3D ICs with Thermal TSVs

Electrical–Thermal Cosimulation of Coaxial TSVs with Temperature-Dependent MOS Effect Using Equivalent Circuit Models

The thermal stress analysis in 3D IC integration with TSV interposer

Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

Fabrication and Traceable Quality Evaluation of Fine Pitch Tsv with Self-Integrated Micro Heater and Thermocouple

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

Simulation and Evaluation of Thermal Mechanical Reliability of 3D-Tsv Stack with Viscoelastic Underfill

Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model

Thermal Fatigue Analysis of Microbumps in a 3D TSV Integration Device