Effect of plasma-assisted N 2 O/Ar oxidation on TOPCon solar cells
Jiabin Huang,Zengchao Zhao,Ming Li,Jun Chen,Xiaorong Zhou,Xinxin Deng,Bin Li,Kailin Shen,Qiuyun Cheng,Xianwu Cai
DOI: https://doi.org/10.1016/j.solmat.2023.112489
IF: 6.9
2023-08-06
Solar Energy Materials and Solar Cells
Abstract:N 2 O/Ar gas mixture are used to deposit ultra-thin silicon oxide (SiO x ) layer by plasma enhanced chemical vapor deposition (PECVD), which is used as the tunneling oxide layer in the TOPCon (tunnel oxide passivated contacts) structure. It is found that the N 2 O/Ar flow ratios strongly affect the properties of SiO x layer, such as deposition rate, the resistance of high temperature, passivation quality, etc., thus significantly affect the properties of polysilicon passivated contact structures and the efficiency of TOPCon solar cells. The deposition rate of SiO x layer and contact resistivity of SiO x /poly-Si(n + )/SiNx:H structure decrease with the increases of Ar flow. However, there is an optimal N 2 O/Ar flow ratio to obtain the best passivation quality and the champion efficiency. The optimal flow ratio of N 2 O/Ar= 5:2 is found, and obtain the optimum thickness of SiO x and uniform polysilicon passivated contact. The highest minority carrier lifetime (τ) of 5751 μs, highest implied open circuit voltage (iV oc ) of 741.3 mV, lowest single side recombination saturation current density(J 0 ) of 4.79 fA/cm 2 , contact resistivity(ρ contact ) of 2.23 mΩ/cm 2 and champion efficiency of 25.06% are obtained at the flow ratio of N 2 O/Ar= 5:2.
materials science, multidisciplinary,physics, applied,energy & fuels