An EBSP Study on the Cube Textured Nickel Substrates

ZHOU Yuan,MENG Jun,LIU Wei,LIU Qing,HAN Zheng-he

DOI: https://doi.org/10.3969/j.issn.1000-6281.2002.05.123

2002-01-01

Abstract:The orientation measurement of nickel substrate has been studied by means of EBSP. Cube texture quality can be showed in a quantitative way and give more complete and effective information on a macroscopic region than by XRD method.

What problem does this paper attempt to address?

An Ex-Situ Study on Epitaxial Growth of Nickel on Copper Substrate in Electrodeposition

Yan-Chin Huang,Ying-Chun Hou,Liuwen Chang,Tao Yan

DOI: https://doi.org/10.1149/08010.0713ecst

2017-10-25

ECS Transactions

Abstract:An ex-situ method was used to study the anisotropy of the epitaxial growth of electrodeposited nickel on polycrystalline copper substrate. The substrate grain orientation was characterized by electron backscatter diffraction (EBSD) technique prior to the electrodeposition. Nickel films of approximately 1 μm thick were then deposited onto the polished substrates in a sulfamate bath at current densities 2 to 250 mA/cm2. The orientation of the Ni film in the prior-analyzed area was characterized again by EBSD to reveal the orientation relationship between each deposit/substrate pair. EBSD analysis was also carried out for thick deposit from a transverse direction to clarify the growth behavior and microstructural evolution on grains of different orientations. Results indicated that epitaxial growth was allowed solely on grains having an orientation of <100>//ND at 2 mA/cm2. On the contrary, nickel deposits grew epitaxially on all grains no matter the orientation as the current density was in a range of 10-100 A/cm2. However, the surfaces of the non-(100) oriented epilayers became rough with increasing thickness and finally they were covered by fine nuclei formed via a twin-mediated nucleation process.
Development and Stability During High Temperature Annealing of the Cube Texture in Rolled Ni Substrate Materials

Y Zhou,A Godfrey,W Liu,Z Han,Q Liu

DOI: https://doi.org/10.1016/s0921-4534(02)02198-6

2003-01-01

Abstract:The development and stability of the cube texture formed during annealing has been investigated, using rolled nickel sheets of 99.95% and 99.999% purity. Microstructure and texture were characterized using electron back-scatter pattern analysis in the scanning electron microscope. The texture following primary recrystallization in both materials showed cube volume fractions of up to 50% and 80% (99.95% and 99.999% Ni respectively). The average grain size of the cube textured grains during recrystallization was larger than for grains of other orientations. For both materials high temperature annealing resulted only in normal grain growth, leading to a significant strengthening of the cube texture. The results are discussed in terms of the relative effects of size, boundary mobility and boundary energy on the process of grain growth. For the 99.999% Ni material an annealing process using a continuous heating ramp to 1200 °C gave a further improvement in the cube texture.
Effect of Annealing Temperature on Cube Texture Formation in Ni7W/Ni12W/Ni7W Compound Substrate

J. Cui,H. L. Suo,J. H. Wang,J.-C. Grivel,S. Kausar,L. Ma,M. Liu,C. Y. Li,Y. T. Ji,Y. Wang

DOI: https://doi.org/10.1134/s0031918x20030060

2020-01-01

Abstract:This study is to fabricate a composite substrate (Ni7W/Ni12W/Ni7W) with weak magnetization, strong reinforcement, and improved cube texture via Rolling Assisted Biaxially Textured Substrates (RABiTS) route. The formation of cube texture with reduction in twin boundaries due to recrystallization annealing was investigated thoroughly. The optimized recrystallization annealing process revealed 97.4% of cube texture and 83.9% of small angle grain boundaries at an angle of (<10°). Higher W content and presence of defects (holes, dislocations, and grain boundaries) within inner layer of the substrate restricted the formation of cube texture along the normal direction (ND), as compared to rolling direction (RD). Furthermore, significant improvement in mechanical strength (σ0.2 = 205 ± 2 MPa) and saturation magnetization (2.6 emu/g) was found for Ni7W/Ni12W/Ni7W as compared to Ni7.5W substrates.
Effects of an external electric field on cube texture development of rolled pure nickel during recrystallization

T.K. Wu,W. Liu,X.L. Li,Q. Liu

DOI: https://doi.org/10.1016/j.matlet.2004.12.039

IF: 3

2005-01-01

Materials Letters

Abstract:The effects of an external electric field on cube texture development have been studied by means of electron backscatter pattern technique, using rolled nickel sheets of 99.999% purity. Samples were annealed at 300 °C for different times both without and with an external electric field, of intensity 2000 V/cm. Results show that the application of an external electric field has decreased the volume fraction of cube texture and the grain size of cube oriented grains.
Preparation and Evaluation of Cube Texture Ni Substrate for Ybco-Coated Superconductor

CF Liu,X Wu,FY Wang,ZJ Yang,Y Feng,PX Zhang,XZ Wu,L Zhou

DOI: https://doi.org/10.1016/s0921-4534(00)00061-7

2000-01-01

Abstract:The cube-textured Ni tapes were prepared by deformation rolling at room temperature and followed by recrystallization annealing at 950–1000°C for 5–10 h in a high vacuum under 10−4 Pa. The formation and evolution of rolling and recrystallization textures have been investigated by X-ray pole figures and orientation distribution function (ODF). The results show that the C {112}〈1117〉 and S {123}〈634〉 orientation densities along β-fiber in rolling textures of Ni substrate increase with increasing reductions; and the cube texture volume fraction index increases, ϕ scan FWHM decreases with increasing heat-treatment temperatures for samples deformed with 95% reduction. In the recrystallization textures, the cube texture component in ODF ϕ=0 section deviates from regular positions (0° 0° 0°) in the range of 12–13° at lower heat-treatment temperature. By increasing the heat-treatment temperature up to 1000°C, the deviation from regular position decreases, and sharp cube texture is formed.
In Situ EBSD Study of Stable Cube Texture in an Advanced Composite Substrate Used in YBCO-Coated Conductors

Yaotang Ji,Hongli Suo,ZiLi Zhang,Lin Ma,Jiazhi Li,Chenxi Zhang,Xinyu Wu,Shaheen Kausar,Jin Cui,Min Liu,Yi Wang,Qiuliang Wang

DOI: https://doi.org/10.1017/S1431927620001415

Abstract:Advanced Ni8W/Ni12W/Ni8W alloy composite substrates used in YBCO-coated conductors with a strong cube texture and high yield strength have been fabricated, and a CeO2 buffer layer film was successfully deposited on the composite substrates. Through in situ tensile testing coupled with electron backscattered diffraction (EBSD) analysis, the stability of the cube texture of Ni8W/Ni12W/Ni8W alloy composite substrates has been investigated. The stress-strain curve shows that the yield strength (at 0.2% strain) of the composite substrates exceeds 250 Mpa. The orientation of grains and boundaries on the surface of the substrates was almost unchanged, while the strain exceeds 0.2%, which indicated that the composite substrates are adequate for depositing buffer layers and YBCO layers by the reel-to-reel process.
Development of the Cube Texture at Low Annealing Temperatures in Highly Rolled Pure Nickel

X. L. Li,W. Liu,A. Godfrey,D. Juul Jensen,Q. Liu

DOI: https://doi.org/10.1016/j.actamat.2007.02.005

IF: 9.4

2007-01-01

Acta Materialia

Abstract:The development of texture and microstructure during recrystallization of pure nickel rolled to very high strains has been investigated. Low-temperature annealing was chosen in order to separate the effects of recrystallization and grain growth. Particular attention was focused on the nucleation and growth of the cube orientation texture component, and on the effect of twinning in producing texture components of other orientations. The growth rates for recrystallizing grains of cube and non-cube orientations were analyzed from the EBSP data using an extended Cahn–Hagel method. Within the estimated experimental errors the growth rates of both orientation classes remain constant during recrystallization, with the cube orientation grains having a higher growth rate by a factor of ∼3. Some minor recrystallization texture components result from twinning, with the role of twinning being most important in the early stages of recrystallization.
Analysis of the Ni-5%at.W Alloy Substrate Texture Evolution at Different Strain Levels Using the EBSD Technique

Xufeng Wang,Hongli Suo,Yaotang Ji,Zili Zhang,Lanjin Wang,Lei Wang,Jianhua Liu,Qiuliang Wang

DOI: https://doi.org/10.3390/ma17215334

IF: 3.4

2024-11-01

Materials

Abstract:In this paper, the texture evolution of the Ni-5%W alloy baseband with different strain variables (εvM = 3.9, 4.9, and 5.1) during rolling and annealing was studied using the electron back scattering diffraction (EBSD) technique. The results indicate that after high-temperature annealing at 1150 °C, all three strain levels of the alloy substrates can achieve a strong cubic texture, with a content exceeding 99% (<10°). However, the texture evolution trajectory is significantly influenced by the strain level. When the content of cubic texture in the alloy substrates under strain levels of 3.9 and 5.1 is the same, significant temperature differences exist. Additionally, the different strain levels result in varying nucleation rates and growth rates of cubic texture in the Ni-5%W alloy substrates. The study reveals that in the alloy substrates under strain levels of 3.9 and 4.9, recrystallized cubic grain nuclei grow within a layered structure, resulting in larger grain sizes and lower nucleation rates. In contrast, in the alloy substrates under a strain level of 5.1, recrystallized cubic grain nuclei form from small equiaxed grains, leading to higher nucleation rates but smaller grain sizes, competing with random orientations. In the later stages of nucleation, recrystallized grains in the alloy substrates under a strain level of 5.1 exhibit a significant size advantage, rapidly growing by engulfing randomly oriented grains. Compared to the alloy substrates with lower strain levels, the recrystallized cubic grains in the alloy substrates under a strain level of 5.1 have higher nucleation rates and faster growth rates.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Monte Carlo Simulation of Cube-Texture Evolution During Grain Growth of High-Purity Nickel

A Godfrey,YB Zhang,F Lin,MA Miodownik,Q Liu

DOI: https://doi.org/10.4028/www.scientific.net/msf.475-479.3149

2005-01-01

Abstract:A Monte Carlo Potts model has been used to investigate cube-texture strengthening during grain growth in rolled high-purity Ni-tapes. The initial conditions for the simulations have been taken from electron back-scatter pattern (EBSP) orientation maps of already fully recrystallized samples. Experimentally, grain growth leads to an increase in the cube volume fraction to > 95%, accompanied by an approximately ten-fold increase in the grain size. High cube volume fractions can be predicted under a number of conditions, though a small surface energy advantage of just 2% for cube-oriented grains is required to match the texture strengthening to the grain size change. An additional issue of interest is the influence on the grain growth of the large area-fraction of twin boundaries in the fully recrystallized condition. The presence of boundaries with low energy has a strong influence on the simulated microstructural evolution.
Modeling of Cube-Texture Evolution During Grain Growth in Ni Thick-Films Based on Experimental Observations

Y. B. Zhang,A. Godfrey,M. A. Miodownik,W. Liu,Q. Liu

DOI: https://doi.org/10.4028/www.scientific.net/msf.558-559.1043

2007-01-01

Materials Science Forum

Abstract:A Monte Carlo Potts model, including anisotropic boundary energies and mobilities, has been used to investigate cube texture evolution. The work is motivated by the post-recrystallization grain growth seen during annealing of highly cold-rolled nickel sheets, It is observed that during such grain growth the cube texture fraction increases from approx. 50% to more than 95%. Electron back-scatter diffraction orientation measurements of fully recrystallized samples have been used to provide starting microstructures for simulations examining the effect of the texture tightness on the development of the cube texture during grain growth. The texture evolution of a single texture component with an initial average size advantage is controlled predominantly by this size advantage once the initial texture spread of this component falls below some value. An additional set of simulations was also carried out to examine grain growth in systems with a quasi-binary texture. The simulations were used to examine cases of grain growth in where one component has a larger average grain size, but where there is still a significant overlap in the grain-size distribution of each component. The initial microstructures were constructed to give different fractions of each texture component, with a given value of both the mean size and the texture spread of each component. The simulations suggest that for such systems there is a well defined range of conditions for which a single texture component can grow to dominate the final texture.
Ion-Beam Bombardment Induced Texture in Nickel Substrates for Coated High-T-C Superconductors

SS Wang,K Wu,Y Zhou,A Godfrey,J Meng,ML Liu,Q Liu,W Liu,Z Han

DOI: https://doi.org/10.1088/0953-2048/16/6/101

2003-01-01

Abstract:Biaxially textured metal substrates are often used for making YBa2Cu3O7-x coated conductors with high critical current density. Generally, specific rolling and high-temperature annealing procedures are required to obtain the biaxial texture for metal substrates. Here, we report on a new method for developing strongly biaxially textured grain structure in rolled nickel tape by argon ion-beam bombardment. X-ray diffraction (XRD) theta-2theta scans have shown that a (200) diffraction peak intensity of the Ni foil processed by ion-beam structure modification (ISM) is two orders of magnitude greater than that of cold-rolled foil, while the (111) and (220) intensities are very weak. In the ISM processed Ni foils, from the rocking curve, the full width at half maximum (FWHM) value of the (200) peak has been found to be less than 5.9degrees. whilst the in-plane FWHM obtained from a pole figure analysis is just 8degrees. We discuss the possible mechanisms leading to the texture changes during ISM.
Application of Ebsp to Directional Solidified Ni3al

Y Wang,J Zhu,YF Han

DOI: https://doi.org/10.1016/s0966-9795(99)00165-x

IF: 4.075

2000-01-01

Intermetallics

Abstract:A new method called EBSP (electron back scattered pattern) is applied to directional solidified Ni3Al alloy. The statistic of the GB that is usually implemented only in TEM can be carried out in SEM too. From OIM (orientation imaging microscopy) of both samples, the statistic of coincide site lattice (CSL) of dendrite GB can be acquired. Through the statistic, percentage of boundary in the longitudinal and transverse direction of both samples can be obtained.
Effect of different deformation and annealing procedures on non-magnetic textured Cu60Ni40 alloy substrates

Jin Cui,Hong-li Suo,Jin-hua Wang,Jean-Claude Grivel,Lin Ma,Chun-yan Li,Yao-tang Ji,Shaheen Kausar,Min Liu,Yi Wang

DOI: https://doi.org/10.1007/s12613-018-1642-3

2018-08-01

Abstract:In this work, a series of specimens was prepared by the casting method. Sharp cube-textured substrates were processed by heavy cold rolling and recrystallization annealing (i.e., the rolling-assisted biaxially textured substrates (RABiTS) method). Both the rolling and the recrystallization texture in the alloy tapes were investigated by X-ray diffraction and electron back-scatter diffraction, respectively. The results showed that a strong copper-type deformation texture was obtained in the heavy cold-rolled substrate. In addition, the recrystallization annealing process was found to be very important for the texture transition in the Cu–Ni alloy substrates. The cube texture content in the Cu60Ni40 alloy substrates reached 99.7% (≤10°) after optimization of the cold-rolling procedure and the recrystallizing heat-treatment process, whereas the content of low-angle grain boundaries (from 2° to 10° misorientation) in the substrate reached 95.1%.

materials science, multidisciplinary,metallurgy & metallurgical engineering,mining & mineral processing
Modeling of Smoothening Effect on Morphologies of Annealed Submicron Nickel Particles Used for Electrically Conductive Adhesives

C. F. Goh,Z. H. Gan,S. G. Mhaisalkar,F. Y. C. Boey,A. M. Gusak,P. S. Teo

DOI: https://doi.org/10.1063/1.2356790

IF: 2.877

2006-01-01

Journal of Applied Physics

Abstract:Microelectronic packaging has been accelerating towards adoption of solutions that offer lower cost, higher electrical performance, and better reliability. Flip chip technology lends itself excellently to these goals. The development of anisotropic and isotropic conductive adhesives (ACA and ICA, respectively) as an alternative to solder bumps has received extensive attention in flip chip packaging as it offers an array of advantages such as finer pitch interconnects, green processes, low cost, and low temperature processing. Nickel, with its lower cost than that of silver and better thermal stability than that of copper, appears to be a viable candidate material for ICA and ACA applications. In the present study, a spiky surface morphology of nickel particles synthesized by means of a hydrothermal reduction method was clearly observed. The spiky morphology may have a detrimental effect on the conductivity of the ICA and ACA flip chip interconnect due to its smaller contact surface and propensity towards oxidation. The morphology of the nickel surface can be changed by annealing the particles between 270 and 360°C for 4–12h. A smoothening effect leading to more or less smooth spherical particles along with an increase in conductivity was observed after annealing at 360°C for up to 12h. An analytical model considering surface diffusion is established here to describe the temperature activated and energy minimization driven smoothening of the Ni particles.
Effect of Reduction on High Temperature Annealing of Cold-Rolled Ni

LI Xiao-ling,LIU Wei,GODFREY Andy,LIU Qing

DOI: https://doi.org/10.3969/j.issn.1009-6264.2007.01.016

2007-01-01

Abstract:The microstructure and texture evolution of cold-rolled Nickel with different reduction during high temperature annealing were investigated by electron back-scattering patterns(EBSP) technique.The results show that cube texture increases with increasing reduction and annealing temperature.The relationship between cube fraction and mean grain size of sample with reduction of 98% indicates that grain growth during recrystallization favours the final sharpness of the cube texture.
Cube texture in heavily cold rolled pure nickel

YB Zhang,XL Li,A Godfrey,W Liu,Q Liu,Dorte Juul Jensen

2008-01-01

Abstract:Zhang, YB, Li, XL, Godfrey, A, Liu, W, Liu, Q & Juul Jensen, D 2008, Cube texture in heavily cold rolled pure nickel. in NH Andersen, MM Eldrup, N Hansen, D Juul Jensen, EM Nielsen, SF Nielsen, BF Sørensen, AS Pedersen, T Vegge & S West (eds), Energy Materials. Advances in Characterization, Modelling and Application: Proceedings. Danmarks Tekniske Universitet, Risø Nationallaboratoriet for Bæredygtig Energi, Roskilde, pp. 393-399, 29th Risø International Symposium on Materials Science, Roskilde, Denmark, 01/09/2008 … Cube texture in heavily cold rolled pure nickel. / Zhang, YB; Li, XL; Godfrey, A.; Liu, W.; Liu, Q.; Juul Jensen, Dorte … Energy Materials. Advances in Characterization, Modelling and Application: Proceedings. ed. / Niels Hessel Andersen; Morten Mostgaard Eldrup; Niels Hansen; Dorte Juul Jensen; Eva Marianne Nielsen; Søren Fæster Nielsen; Bent F. Sørensen; Allan Schrøder Pedersen; Tejs Vegge; …
Cube Texture Development in Pure Ni during Annealing in a High Strength Magnetic Field

Xin Lu Li,Wei Liu,Andrew Godfrey,Qing Liu

DOI: https://doi.org/10.4028/www.scientific.net/MSF.495-497.1315

2005-01-01

Materials Science Forum

Abstract:A 10 Tesla magnetic field was applied during annealing of cold-rolled high purity Ni at 300 degrees C for 2 hours, with samples aligned at various different angles to the magnetic field direction. The effect of the magnetic field annealing on the cube texture evolution and the microstructural development was investigated by use of electron backscatter pattern (EBSP) analysis in the scanning electron microscope. The results show that both the cube texture evolution and the grain size are affected by the application during annealing of a high strength magnetic field, and that the effect varies as a function of the angle between the sample normal and the magnetic field direction. The cube texture volume fraction resulting from 2 hours annealing increases with increasing angle between the field direction and the sample normal direction, though in nearly all cases lower cube volume fractions were obtained compared to annealing without a magnetic field. The average size for all grains and for just cube-oriented grains both decrease with decreasing cube texture fraction, suggesting that the presence of a magnetic field either leads to enhanced recrystallization nucleation, or to a retardation of grain growth after recrystallization.
Systematic investigation of the texture evolution of Cu-Ni alloys with different strains

Hui Tian,Hongli Suo,Yaotang Ji,Xufeng Wang,Lin Ma,Lei Wang,Zili Zhang,Qiuliang Wang

DOI: https://doi.org/10.1016/j.jallcom.2021.163160

IF: 6.2

2022-04-01

Journal of Alloys and Compounds

Abstract:In this study, the texture evolution of CuNi alloy fabricated by rolling and annealing processes with different von Mises strains was systematically investigated by electron backscatter diffraction (EBSD). All the samples with different strains exhibited a strong cube texture after annealing at high temperatures, but the texture evolution trace was apparently affected by the strains. The most significant effect of the strain was the recrystallization nucleation of the cube texture. The distinct nucleation causes a different growth rate of the cube texture and the random texture, which causes a large temperature difference of 550–700 °C between the samples with different strains. This investigation allows us to better understand the texture evolution in CuNi and other FCC alloys after the rolling and annealing processes.

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
Deformation And Annealing Textures Of Extruded And Cold Rolled Pure Ni Single Crystals Of Cube Orientation

Kun Li,Andrew Godfrey,Wei Liu,Qing Liu

DOI: https://doi.org/10.4028/www.scientific.net/KEM.353-358.707

2007-01-01

Key Engineering Materials

Abstract:A Pure Ni single crystal of Cube orientation (001)/[100] have been deformed by reversible cold rolling to a reduction of 98% following an initial extrusion treatment. The microstructure in the as-deformed samples and in partly recrystallized specimens have been characterized in the scanning electron microscope using electron backscattered diffraction (EBSD). Line scans along the normal direction across the sample thickness show some evidence for a macroscopic pattern of subdivision. The EBSD measurements show that the deformed sample is characterized by large jumps in orientation between alternating S and Br orientations, related by misorientation angles of 50 degrees similar to 60 degrees. In part of the sample a background cumulative change in orientation is seen, though local large change in orientation are also still seen. In annealed samples it is found that the orientations of the new grains.
Characterisation of orientation noise for EBSP technique

WU Gui-lin,LIU Qing

DOI: https://doi.org/10.3969/j.issn.1000-6281.2002.05.120

2002-01-01

Abstract: Introduction Electron back-scattered pattern (EBSP) analysis in the scanning electron microscope as a tool for investigating microstructure has been well established. This technique has many advantages over transmission electron microscopy. A drawback of this technique is the angular resolution limit associated with noise in the orientation measurements.

An EBSP Study on the Cube Textured Nickel Substrates

An Ex-Situ Study on Epitaxial Growth of Nickel on Copper Substrate in Electrodeposition

Development and Stability During High Temperature Annealing of the Cube Texture in Rolled Ni Substrate Materials

Effect of Annealing Temperature on Cube Texture Formation in Ni7W/Ni12W/Ni7W Compound Substrate

Effects of an external electric field on cube texture development of rolled pure nickel during recrystallization

Preparation and Evaluation of Cube Texture Ni Substrate for Ybco-Coated Superconductor

In Situ EBSD Study of Stable Cube Texture in an Advanced Composite Substrate Used in YBCO-Coated Conductors

Development of the Cube Texture at Low Annealing Temperatures in Highly Rolled Pure Nickel

Analysis of the Ni-5%at.W Alloy Substrate Texture Evolution at Different Strain Levels Using the EBSD Technique

Monte Carlo Simulation of Cube-Texture Evolution During Grain Growth of High-Purity Nickel

Modeling of Cube-Texture Evolution During Grain Growth in Ni Thick-Films Based on Experimental Observations

Ion-Beam Bombardment Induced Texture in Nickel Substrates for Coated High-T-C Superconductors

Application of Ebsp to Directional Solidified Ni3al

Effect of different deformation and annealing procedures on non-magnetic textured Cu60Ni40 alloy substrates

Modeling of Smoothening Effect on Morphologies of Annealed Submicron Nickel Particles Used for Electrically Conductive Adhesives

Effect of Reduction on High Temperature Annealing of Cold-Rolled Ni

Cube texture in heavily cold rolled pure nickel

Cube Texture Development in Pure Ni during Annealing in a High Strength Magnetic Field

Systematic investigation of the texture evolution of Cu-Ni alloys with different strains

Deformation And Annealing Textures Of Extruded And Cold Rolled Pure Ni Single Crystals Of Cube Orientation

Characterisation of orientation noise for EBSP technique