Abstract:In this paper, the texture evolution of the Ni-5%W alloy baseband with different strain variables (εvM = 3.9, 4.9, and 5.1) during rolling and annealing was studied using the electron back scattering diffraction (EBSD) technique. The results indicate that after high-temperature annealing at 1150 °C, all three strain levels of the alloy substrates can achieve a strong cubic texture, with a content exceeding 99% (<10°). However, the texture evolution trajectory is significantly influenced by the strain level. When the content of cubic texture in the alloy substrates under strain levels of 3.9 and 5.1 is the same, significant temperature differences exist. Additionally, the different strain levels result in varying nucleation rates and growth rates of cubic texture in the Ni-5%W alloy substrates. The study reveals that in the alloy substrates under strain levels of 3.9 and 4.9, recrystallized cubic grain nuclei grow within a layered structure, resulting in larger grain sizes and lower nucleation rates. In contrast, in the alloy substrates under a strain level of 5.1, recrystallized cubic grain nuclei form from small equiaxed grains, leading to higher nucleation rates but smaller grain sizes, competing with random orientations. In the later stages of nucleation, recrystallized grains in the alloy substrates under a strain level of 5.1 exhibit a significant size advantage, rapidly growing by engulfing randomly oriented grains. Compared to the alloy substrates with lower strain levels, the recrystallized cubic grains in the alloy substrates under a strain level of 5.1 have higher nucleation rates and faster growth rates.

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Analysis of the Ni-5%at.W Alloy Substrate Texture Evolution at Different Strain Levels Using the EBSD Technique

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Systematic investigation of the texture evolution of Cu-Ni alloys with different strains

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Effect of stress-relief annealing on rolled texture of nickel-based alloys