Abstract:The coating of nickel (Ni) or Ni-alloy is one of the important metals for engineering applications. These materials have properties such as good corrosion resistance, ferromagnetic, good heat conduction. A few decades, numerous researches on electrodeposition of Ni from Watts's electrolyte solution have been reported. Therefore, in this research, Ni coated on polycrystalline copper (Cu) alloy substrates were prepared with various current density 3 mA/cm², 10 mA/cm², and 25 mA/cm² in watts solution to view more details about the effect of current density on the structure, morphology, and corrosion resistance of these films. The crystal structure, electrochemical behavior, and surface morphology were analyzed using X-Ray Diffraction (XRD), Potentiostat, and Scanning Electron Microscope (SEM) respectively. The difference in current densities affects crystallography parameters, electrochemical behaviors, and surface morphology of Ni layers. There are three major peaks exhibits as (111), (002), and (022) with cubic FCC crystal system and Fm-3m space group. The crystallite size of Ni film increases as the current density rise higher value. The highest corrosion rate is seen on the Ni-25 sample, and it is probably due to larger crystallite size and smaller polarization resistance. Increasing the current density has a significant influence on the reduction peak of Ni layers. As the current density increase, the peaks decrease. All the Ni layers display active-passive-transpassive behavior in 3.5% NaCl. All the Ni film produced shows electrochemically irreversible because the distance between oxidation and reduction peaks is more than 57 mV.

An Ex-Situ Study on Epitaxial Growth of Nickel on Copper Substrate in Electrodeposition

Electron microscope study of electrodeposited Ni films in the 0.1–50 μ range

Evolution of texture in electrodeposited Ni/Cu layered nanostructures

Deposition of nickel films on polycrystalline copper alloy with various current densities from watts solution

Influence of Nano-Al2O3 Particles on Nickel Electrocrystallization at Initial Stage

Growth Kinetics of Nickel Crystals in Nanopores

Effect of the diffusion rate of the copper ions on the co-electrodeposition of copper and nickel

In-situ Monitoring of Nickel Electrodeposit Structure Using Electrochemical Noise Technique

Microstructure, nanoindentation, and electrochemical properties of the nanocrystalline nickel film electrodeposited from choline chloride–ethylene glycol

Electrochemical study of Ni deposition on carbon microfiber

Nickel electrodeposition from deep eutectic solvents containing copper ions at a high temperature

Electrochemical co-deposition of carbon nanotube/Ni composite layer

Crystal Orientation Dependence of Precipitate Structure of Electrodeposited Li Metal on Cu Current Collectors

An EBSP Study on the Cube Textured Nickel Substrates

Nickel Co-Deposition with SiC Particles at Initial Stage

(Digital Presentation) On Epitaxial Electrodeposition of Co, Ru and Cu for Interconnect Applications

In Situ Study of Copper Electrodeposition on A Single Carbon Fiber

The Influence of the Substrate and External Magnetic Field Orientation on FeNi Film Growth

Electrochemical study and structural comparison of Ni electrodepositions on W/Si and Cr/C multilayered structure films

Epitaxial (111) Films of Cu, Ni, and Cu$_xNi$_y$ on α-Al$_2$O$_3$(0001) for Graphene Growth by Chemical Vapor Deposition

Electrochemical Epitaxy and XMCD Study of Co-Ni Alloy Film