Effect of the diffusion rate of the copper ions on the co-electrodeposition of copper and nickel

Jae Min Lee,Sung Ho Lee,Young Jun Kim,Jong Soo Ko

DOI: https://doi.org/10.1007/s12541-013-0273-x

IF: 2.0411

2013-11-01

International Journal of Precision Engineering and Manufacturing

Abstract:This study experimentally analyzed the influence of the diffusion rate of Cu ions on the growth of microstrucutres during the coelectrodeposition of copper and nickel. To change the diffusion rate of the Cu ions resolved in the electrodeposition solution, electrodeposition was performed under three different stirring conditions (0, 150, 300 rpm). The microstructure grew in an orientation vertical to the microstructure, similar to a probe without stirring, while a popcorn-shaped cluster with electrodeposition particles at the upper part of the microstructure was found under the stirring condition. Forced circulation of the electrodeposition solution by stirring drastically enhanced the movement of the Cu ions, and popcorn shaped clusters are formed. The average height and width of the structure electrodeposited for 20 minutes through stirring at 300 rpm were 1.5 and 4.3 times greater, respectively, than those of the structure electrodeposited without stirring. The substrate surfaces covered with electrodeposited microstructures were modified to be superhydrophobic by coating them with hydrophobic plasma polymerized fluorocarbon (PPFC).

engineering, mechanical, manufacturing