Abstract:The Cu materials are playing an irreplaceable role in modern marine facilities, while one major issue affecting their service life is corrosion attack caused by external erosion of chloride ions, which leads to the quickly structural deterioration and reduced durability. To solve this obstinate issue, the corrosion−resistant Ni−based composite films with conductive Yttria–stabilized zirconia (YSZ, 2.5–15 g/L) and non−conductive Si 3 N 4 (2.5–15 g/L) reinforcing phases were composite–electrodeposited on Cu substrate in direct current (DC) mode. It was believed that the electrical differences of incorporated nanoparticles have a significant impact on nucleation and growth behaviors during electrodeposition, which further altered the structure and property of Ni−based composite films. Therefore, the emphasis of this study was to establish the correlation between obtained structure, electrochemical, and immersion corrosion performances at different incorporation levels of YSZ/Si 3 N 4 nanoparticles. The results demonstrate that by increasing the total doping contents, the Electrochemical Impedance Spectroscopy (EIS) and Chronoamperometry (CA) measurements exhibited an initial increase followed by a subsequent decrease on co−deposition dynamics, which was related to the dominant impact of conductive YSZ nanoparticle at electrocrystallization process. Meanwhile, the moderate incorporation level of 15 g/L offered effective control over structural compactness through dispersion−strengthening and grain−refining, and the same ratio of YSZ/Si 3 N 4 nanoparticles further maximized the improvement degree of microhardness, electrochemical passivation, and immersion stability of resulting films. Besides, the corrosion current density ( j corr ) of Ni−YSZ−Si 3 N 4 composite coating under optimum condition of 15 g/L was two orders of magnitude smaller than that of Cu substrate after long−term immersion test, and the corresponding polarization resistance ( R p ) also increased by 8.6 times. Overall, these substantial alterations obtained provide effective guideline for the design and preparation of corrosion−resistant Ni−based composite coating, which is beneficial to prolonging the service life of Cu components in saline environments.

Effect of cupric sulfate on the microstructure and corrosion behavior of nickel-copper nanostructure coatings synthesized by pulsed electrodeposition technique

Effect of Sulfate Ions on Anodic Polarization Behavior of Nanocrystalline Copper Bulk

Structure and corrosion property of pulse electrodeposited nanocrystalline nickel-tungsten-copper alloy coating

Electrochemical behavior and electro-crystallization mechanism of Cu-Ni/Nano-Al 2 O 3 coating with a deposition current density dependence

In Situ Study of Copper Electrodeposition on A Single Carbon Fiber

Electrodeposition fabrication of corrosion−resistant Ni–based composite film on surface of Cu: Role of conductive YSZ and non−conductive Si 3 N 4 nanoparticles

Electrodeposition and Corrosion Behavior of Nanostructured Ni-Tin Composite Films

Microstructure and Electrochemistry Behavior of Ni-Cu-P Ternary Nickel-Based Amorphous Coating

Investigation on the Electrochemical Catalysis Properties of Ni-decorated Nanoporous Copper Formed by Hybrid Laser Deposition

Influence of Cu Content on the Microstructure and Mechanical Properties of Cr-Cu-N Coatings

Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper–Nickel Alloys

Microstructure and properties of Cu-Sn-Zn-TiO2 nano-composite coatings on mild steel

In Situ Thermal Interactions of Cu-Based Anti-Corrosion Coatings on Steel Implemented by Surface Alloying

INFLUENCE OF SURFACE ROUGHNESS OF SUBSTRATE ON THE PROPERTIES OF Ni–Co–Fe ELECTRODEPOSITION COATING ON COPPER

Effect of pH on the electrodeposition nucleation and growth mechanism of cuprous oxide

Influence of Different Copper Feedstock Powders on the Microstructure and Corrosion Resistance of Coatings Prepared by Cold Gas Spray

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath

Electrodeposition and corrosion performance of Ni-Co alloys with different cobalt contents

Effect of the diffusion rate of the copper ions on the co-electrodeposition of copper and nickel

Electrodeposition of Nanostructured Co–Cu Thin Alloy Films on to Steel Substrate from an Environmentally Friendly Novel Lactate Bath under Different Operating Conditions