Microstructure and Electrochemistry Behavior of Ni-Cu-P Ternary Nickel-Based Amorphous Coating

Zhang,Jingli
DOI: https://doi.org/10.1590/1980-5373-mr-2024-0258
2024-10-18
Materials Research
Abstract:Zhou, Mengran ; Sun, Wanchang ; Liu, Eryong ; Xu, Yifan ; Zhang, Bo ; Cai, Hui ; Zhang, Jingli ; Enhanced corrosion-resistant Ni-Cu-P amorphous coatings were applied to AZ91D magnesium alloy substrates using an integrated approach that included direct-current (DC) copper pre-plating and electroless Ni-Cu-P plating at varying CuSO4 concentrations. The effects of CuSO4 concentration on the microstructure, electrochemistry behavior and corrosion rate of Ni-Cu-P coatings and the adhesion between the Ni-Cu-P coating and the magnesium alloys substrate were investigated. The results indicated that the surface of the Ni-Cu-P ternary coating which integrated well with the magnesium alloys substrate exhibited heterogeneous cell structure with relatively flat and dense structure. When the CuSO4 concentration was 0.8 g/L, the mass fraction of P in the coating was 9.06 wt% meaning amorphous Ni-Cu-P coating. The results of the Nyquist and Bode graph, corrosion rate, corrosion morphologies and of the Ni-Cu-P coatings with different CuSO4 addition indicated that the corrosion resistance reached optimization with corrosion potential of -0.31 V, the corrosion current density of 0.0039 A/cm2 when the CuSO4 concentration is 0.8 g/L. Furthermore, the adhesion test confirmed that the adhesion of Ni-Cu-P coatings improved gradually as the CuSO4 concentration increased and exhibited optimum when added 1.0 g/L CuSO4. The obtained Ni-Cu-P coating with amorphous structure prevented effectively magnesium alloy from corrosion.
materials science, multidisciplinary
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