Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper–Nickel Alloys

Sang-Du Yun,Yeonwon Kim,Jun-Seok Lee,Jung-Pil Noh,Beom-Soo Kim,Jae-Sung Kwon,Sung-Woong Choi,Jeong-Hyeon Yang

DOI: https://doi.org/10.3390/coatings14010132

IF: 3.236

2024-01-19

Coatings

Abstract:To investigate the improvements in the resistance of Cu–Ni alloys to surface pitting corrosion, Cu–Ni thin films containing Al were fabricated via DC magnetron sputtering. The morphologies of the fabricated samples were obtained using a scanning electron microscopy, which yielded information on the crystal size and sample surface before and after corrosion tests. X-ray diffraction was employed for the structural characterization of the as-deposited films, and vibrational spectroscopy was used to verify the corrosion products. The corrosion behaviors of the Cu–Ni and Cu–Ni–Al samples were examined using electrochemical polarization and cyclic corrosion tests. The Al co-deposited samples showed a refined crystal size as compared to the Cu–Ni sample, suggesting that they are more susceptible to the formation of a passivation film. The corrosion current density of the Cu–Ni–Al was reduced, and the corrosion potential was lower than that without Al content. The negative shift in the corrosion potential of the Al-containing samples indicates that the Al2O3 film suppressed the cathodic reaction, resulting in a decrease in the corrosion rate. These results are consistent with the cyclic corrosion test results, in which no pitting corrosion is observed in the Cu–Ni–Al sample.

materials science, multidisciplinary,physics, applied, coatings & films

What problem does this paper attempt to address?

The paper primarily explores the issue of enhancing the pitting corrosion resistance of copper-nickel alloy films by co-depositing aluminum through DC magnetron sputtering technology.

To improve the corrosion resistance of copper-nickel (Cu–Ni) alloys in chloride ion-containing marine environments, the research team prepared aluminum (Al)-containing copper-nickel alloy films using the DC magnetron sputtering method and characterized these films and tested their corrosion performance.

### Main Findings

1. **Film Morphology and Composition**:
- Cu–Ni–Al alloy films with different aluminum contents were prepared. As the aluminum content increased, the grain size decreased, and the surface became denser.
- Field Emission Scanning Electron Microscopy (FE-SEM) observations showed that after adding aluminum, the grain distribution became more uniform, and the grain size decreased with the increase in aluminum content.

2. **Crystal Structure**:
- X-ray Diffraction (XRD) analysis showed that the addition of aluminum caused the diffraction peaks to shift to lower angles, indicating a reduction in grain size.
- The Williamson-Hall model was used to determine the grain size, and the results showed that the average grain size of Cu70–Ni30 was about 49.48 nm, while the average grain size of Cu70–Ni10–Al20 was about 12.98 nm.

3. **Corrosion Behavior**:
- The corrosion behavior of the materials was evaluated through Cyclic Corrosion Testing (CCT) and electrochemical polarization tests.
- Significant pitting corrosion was observed in the Cu70–Ni30 samples without aluminum, while no pitting was observed in the samples containing aluminum.
- After adding aluminum, the corrosion current density decreased, and the corrosion potential became more negative, indicating that the aluminum oxide layer inhibited the cathodic reaction, thereby reducing the corrosion rate.

4. **Corrosion Products**:
- Raman spectroscopy analysis confirmed the presence of corrosion products, including CuO, Cu2O, and Cu2(OH)3Cl.
- The Cu2O protective film formed in the copper-nickel alloy is easily hydrolyzed into CuO, leading to increased pitting sensitivity; however, the addition of aluminum can stabilize the Cu2O protective film and improve corrosion resistance.

In summary, the study experimentally demonstrated that adding aluminum to copper-nickel alloys can effectively enhance their pitting corrosion resistance in chloride ion-containing environments, which is significant for developing highly corrosion-resistant materials suitable for harsh marine environments.