Abstract:Abstract To meet the requirements of automatic production, a new type of green BAl88Si cored solder was developed. The lap brazing experiments were carried out with copper and aluminum as brazing substrates. The microstructure, phase composition, and corrosion behavior of solder joint interface were studied by field emission scanning electron microscopy, energy dispersive spectroscopy, transmission electron microscopy, electron backscattering diffraction, tensile testing machine, and electrochemical workstation. The results show that the brazing joint of Cu/BAl88Si/Al is metallurgical bonding, and the brazing joint of Cu/BAl88Si/Al is composed of Cu 9 Al 4 , CuAl 2 , a-Al, (CuAl 2 + a-Al + Si) ternary eutectic. In addition, there is no obvious preference for each grain in the brazing joint, and there are S texture {123} , Copper texture {112} , and Brass texture {110} . The interface of Cu 9 Al 4 /CuAl 2 is a non-coherent crystal plane and does not have good lattice matching. The average particle size of CuAl 2 is 11.95 μm and that of Al is 28.3 μm. However, the kernel average misorientation (KAM) value at the brazed joint interface is obviously higher than that at the brazed joint interface copper, so the defect density at the brazed joint interface aluminum is higher than that at the brazed joint interface copper. At the same time, due to poor corrosion resistance at the interface on the aluminum side of the brazed joint, serious corrosion spots and corrosion cracks occur at the same time, which leads to the shear performance of the brazed joint decreasing by about 75% after salt spray test for 240 h.

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Effects of Cu Addition on the Microstructure and Properties of the Al–Mn–Fe–Si Alloy

Effect of Ni on the wetting and brazing characterization of 304 stainless steel by Ag–Cu alloy

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Electrochemical corrosion behaviour of Zn-Sn-Cu-xNi lead-free solder alloys

Effects of Al addition on corrosion behavior and mechanical property of high-strength and high-elasticity Cu-20Ni-20Mn-0.3Nb-0.3Cr-0.3Zr alloy

Effect of Al/Ni Ratio on the Microstructure and Properties of Nickel-Aluminum Bronze Alloys

Effects of Sn and Nb Additions on the Corrosion Resistance of Cu-Ni-Si-Mg Alloy

Effect of Al Element on the Microstructure and Properties of Cu-Ni-Fe-Mn Alloys

Effects of Ni content on microstructure and wear behavior of Al–13Si–3Cu–1Mg-xNi-0.6Fe-0.6Mn alloys

Effects of Ti Addition on Microstructure, Mechanical Properties and Corrosion Resistance of the Cu-Zn-Ni Alloy

Effect of Ni addition on the microstructure, conductivities and mechanical properties of as-cast Al-Fe alloys

Effect of Fe/Mn content on mechanical and corrosion properties of 90/10 copper–nickel alloy

Influence of microalloying with B on the microstructure and properties of brazed joints with Ag–Cu–Zn–Sn filler metal

Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper–Nickel Alloys

Analysis of Ni-Cu Interaction in Aluminum-Based Alloys: Hardness, Tensile and Precipitation Behavior

Pitting Corrosion Behavior in Novel Mn–N Alloyed Lean Duplex Stainless Steel Containing Cu

Phase analysis and corrosion behavior of brazing Cu/Al dissimilar metal joint with BAl88Si filler metal

Effects of Fe/Ni ratio on microstructure and properties of FeNiCrAlNb high entropy alloys

Influence of Cr and Ni elements on the electrochemical and early corrosion behavior of FeMnAlC low-density steel

Effects of Intermetallic-Forming Element Additions on Microstructure and Corrosion Behavior of Sn–Zn Solder Alloys