Effect of Additive Methyl Nicotinate on Electrochemical Behavior of Nickel–Copper Alloy Electrodeposition in ChCl-EG Deep Eutectic Solvents

Siqi Zhang,Mingxiao Xu,Mingxue Bi,Haijing Sun,Jie Sun
DOI: https://doi.org/10.1134/s0036024424030270
2023-12-01
Russian Journal of Physical Chemistry A
Abstract:The effect of additive methyl nicotinate (MN) on the electrochemical behaviors of nickel and copper ions were studied by cyclic voltammetry (CV) using choline chloride (ChCl)-ethylene glycol (EG) deep eutectic solvents as the base solution. The results showed that the addition of MN changed the reduction potential of nickel and copper ions, and the adsorption of MN made the reduction potential shift negatively from –1.131 to –1.237 V. The addition of MN changed the reduction process of nickel-copper ions, and it was still an irreversible process controlled by diffusion. The chronoamperometry (CA) method was used to study the growth nucleation mode of nickel and copper. The results showed that the addition of MN changes the nucleation mode of nickel and copper, which is a nucleation feature of three-dimensional instantaneous nucleation changes to three-dimensional progressive nucleation. The differential capacitance curve was used to study the action mechanism of MN on the surface of the electrode. The results showed that MN increased the thickness of the double electrode layer by adsorption on the electrode surface, thus reducing the differential capacitance by 2–10 μF. The corrosion resistance of nickel-copper coating in 3.5 wt % NaCl was studied by using kinetic potential polarization curve. The results showed that the self-corrosion potential shifted positively and the corrosion current density decreased after the addition of MN, which made the nickel-copper alloy have higher corrosion resistance. The results of X-ray diffraction (XRD) showed that the addition of MN changed the preferential growth of nickel-copper deposition. The texture coefficient was used to quantify the preferred orientation, and the results showed that the addition of MN made the (220) crystal plane of the coating appear high priority orientation. The effect of MN on the microstructure of the coating was studied by scanning electron microscopy (SEM), and the results showed that the presence of MN changed the nickel-copper coating from a needle-like coating with fine cracks to a compact spherical coating.
chemistry, physical
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