Electrodeposition Mechanism of Nickel in Addic Electroplating Bath Containing Organic Additives

LI Jun-hua,KUANG Dai-zhi,FENG Yong-lan,FEI Xi-ming,ZENG Rong-ying
DOI: https://doi.org/10.16577/j.cnki.42-1215/tb.2010.08.019
2010-01-01
Abstract:The effects of commonly used or-ganic additives saccharin,1 ,4-butynediol and the mixture of both on electrodeposition of nickel in acidic plating bath were investi-gated by means of cyclic voltammetry,alternate current imped-ance spectroscopy and potential step test.Results show that or-ganic additives cause negative shifts of deposition potential of nickel,and the electrode process is irreversible.Electron-trans-fer and adsorption of intermediate products were involved in the electrodeposition of nickel.The cathodic overpotential of nickel electrodeposition was increased by about 650 mV when the two kinds of organic additives were introduced at the same time,and the number of nucleation sites also increased,benefiting to gener-ating bright nickel coating.Besides,I2/I2m-t/tm curves of nickel electrodeposition in the presence of the organic additives were close to the theoretical instantaneous nucleation curve,which in-dicated that nickel deposition in the presence of the organic addi-tives followed the electrocrystallization mechanism of instantane-ous nucleation and three-dimensional growth.
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