Copper Deposition and Formation of Nano-Particles

Priyabrata Pal,Muhammad Nazim,Binay Kanti Dutta,Ahmed AlShoaibi
DOI: https://doi.org/10.1080/01496395.2014.937498
IF: 2.799
2014-11-14
Separation Science and Technology
Abstract:The cementation of copper ions from copper sulfate solution was studied using iron wire and iron powder. The influence of initial copper concentration has considerable effect on cumulative copper deposition. The copper deposition rate data could be interpreted by using shrinking core model. The effects of temperature and pH were substantial and have been studied and interpreted. The activation energy of the system within the temperature range of 23–54°C was found to be 14.23 (iron wire) and 30.20 kJ per mol (iron powder), respectively. The morphology of copper deposits studied showed that the reactions have the potential to produce particle sizes within nano range.
engineering, chemical,chemistry, multidisciplinary
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