Abstract:In this paper, isotropic copper nanoparticles (CuNPs) were successfully sythesized by using Cu(CH 3 COO) 2 and ascorbic acid in absolute ethanol solution. With the addition of polyvinylpyrrolidone (PVP) protective additive, the size distribution range of the synthesized CuNPs was significantly reduced from 650 ± 415 nm to 51 ± 12 nm. Electrodeposition analysis revealed that PVP could greatly suppress the reduction of Cu but had no prominent effects on the deposition mechanism. Based on the potentiostatic deposition results, a growth model was proposed to improve the applicability of the Scharifker‐Hills model by considering both the surface inhibition effect and the mass diffusion during the growth process of Cu nuclei. The experimental data fitted well with the prediction results from the proposed model, indicating that the electrodeposition of Cu followed the progressive nucleation process. The PVP additive could inhibit the deposition and growth of Cu by increasing the surface inhibition for cation incorporation on the nuclei, which was probably the main reason for the refinement of the sythesized CuNPs. Our findings can provide insights for the preparation of metallic nanoparticles and the understanding of their deposition mechanism.

What problem does this paper attempt to address?

The paper primarily addresses the issue of size control during the synthesis of copper nanoparticles (CuNPs) and delves into the mechanism of action of polyvinylpyrrolidone (PVP) as a protective additive. ### Main Issues Addressed by the Paper 1. **Size Control**: By adjusting the amount of PVP added, the size distribution range of the synthesized copper nanoparticles was successfully reduced from 650 ± 415 nanometers to 51 ± 12 nanometers. 2. **Understanding the Electrochemical Deposition Mechanism**: The study investigated how PVP affects the electrochemical deposition process when synthesizing copper nanoparticles using Cu(CH3COO)2 and ascorbic acid in absolute ethanol solution through a wet chemical reduction method. It was found that PVP significantly inhibits the deposition rate of copper but has little effect on the deposition mechanism itself. 3. **Proposing a Growth Model**: Based on the electrochemical deposition results, an improved Scharifker-Hills model was proposed to better describe the surface inhibition effect and mass diffusion during the growth process of copper nuclei. 4. **Revealing the Mechanism of PVP**: Electrochemical analysis confirmed that PVP inhibits the deposition and growth of copper by increasing the surface inhibition effect of copper ions on the nuclei, which is the main reason for the refinement of copper nanoparticle size. ### Conclusion This paper studied the synthesis and growth mechanism of copper nanoparticles through electrochemical methods and revealed the specific role of PVP as a protective additive in this process. These findings are significant for understanding the deposition mechanism of metal nanoparticles and optimizing their synthesis conditions.

Size Refinement of Copper Nanoparticles: A Perspective from Electrochemical Nucleation and Growth Mechanism

Cover Feature: Size Refinement of Copper Nanoparticles: A Perspective from Electrochemical Nucleation and Growth Mechanism (5/2021)

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