Modeling of On-Chip Rf Passive Components

Zhiping Yu
DOI: https://doi.org/10.1007/978-90-481-8614-3_12
2010-01-01
Abstract:The challenge for accurate modeling of on-chip RE passive components, L/C/R, lies on the proper consideration of undesired parasities and capturing of distributed nature of the structure at high frequency. This is especially true for inductive components, namely inductors and transformers including baluns, because of the open capacitive and (long-range) magnetic couplings between the top widing metal layers and the lossy silicon substrate.This chapter is mostly focused on the equivalent circuit modeling (i.e., compact modeling) of spiral inductors and transformers, while the modeling of on-chip resistors and capacitors are briefly mentioned. Among the modeling of spirals inductive components, the emphasis is on the calculation and extraction of three key parameters: inductance L (and for transformers also the magnetic coupling coefficient k between the primary and secondary windings), quality factor Q, and self-resonant frequency SRF (due to inevitable parasitic capacitance across the port of the inductor). Both one-pi and two-pi circuit topologies for inductor modeling are reviewed with tilt toward the former because of its renaissance recently. The discussion on transformer modeling is largely based on the seminal work by Long (IEEE J. Solid-State Circuits 35(9): 1368, 2000). Up-to-date circuit applications of spiral transformers are provided as a motivation of studying this important subject.
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