Abstract:The challenge for accurate modeling of on-chip RE passive components, L/C/R, lies on the proper consideration of undesired parasities and capturing of distributed nature of the structure at high frequency. This is especially true for inductive components, namely inductors and transformers including baluns, because of the open capacitive and (long-range) magnetic couplings between the top widing metal layers and the lossy silicon substrate.This chapter is mostly focused on the equivalent circuit modeling (i.e., compact modeling) of spiral inductors and transformers, while the modeling of on-chip resistors and capacitors are briefly mentioned. Among the modeling of spirals inductive components, the emphasis is on the calculation and extraction of three key parameters: inductance L (and for transformers also the magnetic coupling coefficient k between the primary and secondary windings), quality factor Q, and self-resonant frequency SRF (due to inevitable parasitic capacitance across the port of the inductor). Both one-pi and two-pi circuit topologies for inductor modeling are reviewed with tilt toward the former because of its renaissance recently. The discussion on transformer modeling is largely based on the seminal work by Long (IEEE J. Solid-State Circuits 35(9): 1368, 2000). Up-to-date circuit applications of spiral transformers are provided as a motivation of studying this important subject.

RF CMOS is More Than CMOS: Modeling of RF Passive Components

Quasi-Static Derived Physically Expressive Circuit Model for Lossy Integrated RF Passives

A derived circuit model for spiral inductors on lossy silicon substrate

A Derived Physically Expressive Circuit Model For Integrated Passives In Rfic

Modeling of On-Chip Rf Passive Components

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

An Improved RF MOSFET Model Accounting Substrate Coupling among Terminals

A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors

Electrothermal modeling of coaxial through silicon via (TSV) for three-dimensional ICs

Scalable RFCMOS Model for 90 Nm Technology

Three-solenoid Windings Transformer Baluns on CMOS-grade Silicon Substrate

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

Scalable Compact Circuit Model for Differential Spiral Transformers in CMOS RFICs

Modeling of On-chip Transformers for RFIC Design

Modeling and Optimization of Substrate Electromagnetic Coupling and Isolation in Modern Lightly Doped CMOS Substrate

Equivalent Circuit Model of On-Wafer Interconnects for Cmos Rfics

Transfer Function Analysis and Broadband Scalable Model for On-Chip Spiral Inductors

Design Optimization and Modeling of On-Chip RF Inductors in 0.13&#x00b5;m and 90nm Standard CMOS

Scalable Compact Circuit Model and Synthesis for RF CMOS Spiral Inductors

Analysis of modeling approaches for on-chip spiral inductors