A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

JianYong Xie,Wenyan Yin,Jinglin Shi,Kai Kang,Junfa Mao
DOI: https://doi.org/10.1109/APMC.2007.4555009
2007-01-01
Abstract:A compact circuit model for predicting performance parameters of multi-layer inductors is proposed in this paper. This model, which does not use any fitting and optimized parameters, modeled eddy currents loss in the silicon substrate, skin and proximity effects in metal tracks, which is combined with partial element equivalent circuit (PEEC) method. Excellent agreements are obtained between the modeled and measured inductance and Q-factor of fabricated multi-layer spiral inductors up to 20 GHz.
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