Abstract:Due to the slow scaling of board and package technology, on-chip inductor has shown promising potential to enable more compact design and smaller parasitics for inductor-based designs, such as voltage regulator, resonant clocking, filter, etc. On the other hand, conventional on-chip 2D spiral inductor must be placed on the top metal layers, thereby consuming significant routing resources for global interconnects. Moreover, it may need more dedicated shielding to prevent unnecessary coupling, which further increases its occupied area. With the popularity of 2.5D and 3D chip architecture, Through-Silicon-Via (TSV) has been widely used, a significant portion of which are placed for thermal/manufacturability/reliability purposes. Thus, those redundant TSVs can be utilized to form the on-chip inductor for 2.5D/3D chips, with lower footprint and higher inductance density compared from the conventional spiral inductor. Unlike prior works focusing on the inductor itself, this paper discusses the optimization and application of such TSV-inductor from system perspective, including the optimization options and its design considerations. The possible design options including physical parameters, architecture and materials, to optimize the TSV-inductor are thoroughly investigated. Based on that, we further study a few key design scenarios to evaluate the design impact with use of such TSV-inductor and provide the design guidelines for its application in actual system designs.

PERFORMANCE TRENDS OF ON-CHIP SPIRAL INDUCTORS FOR RFICS

Model Description and Parameter Extraction of On-Chip Spiral Inductors for MMICs

Global Performance Evaluation of Various On-Chip Square Spiral Inductors on Gaas Substrates

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Electrical Characteristics and Behavioral Model of Spiral Inductors On Gaas Substrate

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

Experimental Characterisation Of On-Chip Octagonal Double-Helix Inductors On Silicon Substrates

Double-level Spiral Inductors with Multiple-Via Interconnects on GaAs Substrates

System-level Design Consideration and Optimization of Through-Silicon-via Inductor.

A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors

Comparative Characteristics of On-Chip Single- and Double-Level Square Inductors

TSV inductor optimization and its design implication

Compact Equivalent Circuit Model Of Two-Layer Spiral Inductors

On the Efficacy of Through-Silicon-Via Inductors

Local scalable description of global characteristics of various on-chip asymmetrically octagonal inductors

Electromagnetic-Thermal Analysis for Inductances and Eddy Current Losses of On-chip Spiral Inductors on Lossy Silicon Substrate

Temperature Effects on the Performance of On-Chip Spiral Inductors Used in RF(MM)ICs

A derived circuit model for spiral inductors on lossy silicon substrate

Modeling and Simulation of Spiral Inductors in Wafer Level Packaged RF/Wireless Chips

Analysis of modeling approaches for on-chip spiral inductors

Accurate Model for Micromachined Microwave Planar Spiral Inductors