Abstract:Based on several extended formulas to determine all frequency- and temperature-dependent distributed parameters of on-chip coupled asymmetrical and symmetrical interconnects on silicon substrates, the electromagnetic-thermal characteristics of interconnects were investigated in detail, including 1) wideband series impedances and shunt conductances, 2) conductive and dielectric attenuation constants of even(c) and odd (pi)-mode, 3) pulse waveform distortion and crosstalk, and 4) average power handling capability (APHC). In these investigations, a set of modified formulas were proposed to determine the mutual conductance and capacitance of asymmetrical configuration. Appropriate thermal models were employed to evaluate the rise in temperature of metal interconnects, where the lateral heat dissipation was taken into account for different spacings between two interconnects. Parametric calculations were performed to capture the hybrid effects of all geometric and physical parameters of metal interconnects, such as line thickness, line conductivity, and silicon conductivity. All numerical examples are believed to be useful in the design of (a)symmetrical interconnects for digital and radio frequency circuits.

Local scalable description of global characteristics of various on-chip asymmetrically octagonal inductors

Experimental Characterisation Of On-Chip Octagonal Double-Helix Inductors On Silicon Substrates

Comparative Characteristics of On-Chip Single- and Double-Level Square Inductors

Model Description and Parameter Extraction of On-Chip Spiral Inductors for MMICs

Global Performance Evaluation of Various On-Chip Square Spiral Inductors on Gaas Substrates

Experimental Characterization of Coupling Effects Between Two On-Chip Neighboring Square Inductors

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Vertical Topologies of Miniature Multispiral Stacked Inductors

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

PERFORMANCE TRENDS OF ON-CHIP SPIRAL INDUCTORS FOR RFICS

Capacitance extraction of on-chip circular stacked inductors

Experimental Characterization of On-Chip Inductor and Capacitor Interconnect: Part I. Series Case

Electrical Characteristics and Behavioral Model of Spiral Inductors On Gaas Substrate

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors

Double-level Spiral Inductors with Multiple-Via Interconnects on GaAs Substrates

A Study of On-Chip Stacked Multiloop Spiral Inductors

Modeling and Characterization of On‐Chip Interconnects

Performance Characterization of Circular Silicon Transformers

A derived circuit model for spiral inductors on lossy silicon substrate

Compact Equivalent Circuit Model Of Two-Layer Spiral Inductors