Abstract:This work reports a new simulated inductor which is suitable for a Contactless Electrical Tomography (CET) system and can effectively overcome the unfavorable influence of coupling capacitance on the measurement results. By detailed analysis and comparison, it is found that the grounded simulated inductor has a simple circuit construction but its output current is not equal to its input current, while the floating simulated inductor can be used as an independent inductor module but its circuit structure is relatively complex. A new simulated inductor is designed by compensating the currents from the common node of an introduced independent power source to the main circuit. The new simulated inductor combines the advantages of the grounded simulated inductor and the floating simulated inductor. It has the simple construction similar to that of the grounded simulated inductor and its input current is equal to the output current, which means it can be used as an independent module. The impedance measurement and practical image reconstruction experiments were carried out to verify the effectiveness of the new simulated inductor. The experimental results show that the design of the new simulated inductor is successful, and the performance of the impedance measurement is satisfactory. The signal-to-noise ratio of the CET system is improved. Meanwhile, the research work also indicates that in the case when the independent power source is not available, the new simulated inductor is also an effective alternative method. But the phase difference between input signal and output signal is approximately 90° when the elimination principle is realized.

Capacitance extraction of on-chip circular stacked inductors

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Parasitic Inductance Modeling for On-chip Interconnects Based on IC Analysis on Inductive Effects

Comparative Characteristics of On-Chip Single- and Double-Level Square Inductors

Experimental Characterization of On-Chip Inductor and Capacitor Interconnect: Part I. Series Case

Capacitance Extraction of Three-Dimensional Interconnects Using Element-By-Element Finite Element Method (Ebe-Fem) and Preconditioned Conjugate Gradient (pcg) Technique

Local scalable description of global characteristics of various on-chip asymmetrically octagonal inductors

Capacitance extraction of high-density 3D interconnects using finite element method

Experimental Characterisation Of On-Chip Octagonal Double-Helix Inductors On Silicon Substrates

A Study of On-Chip Stacked Multiloop Spiral Inductors

Experimental Characterization of Coupling Effects Between Two On-Chip Neighboring Square Inductors

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

Vertical Topologies of Miniature Multispiral Stacked Inductors

Novel LC resonant clocking for 3D IC using TSV-inductor and capacitor

On the Design of a New Simulated Inductor Using a Contactless Electrical Tomography System As an Example

Investigation of On-Chip Soft-Ferrite-Integrated Inductors for Rf Ics-Part Ii: Experiments

The Magnetized Capacitance, First Resonant Frequency, and Electromagnetic Analysis of Inductors With Ferrite Cores

On-chip soft-ferrite-integrated inductors for RF IC

Capacitive coupling analysis of TSV array in 3D packaging

An LC Resonant Method for the Accurate Extraction of Small Parasitic Resistance