Abstract:Due to the slow scaling of board and package technology, on-chip inductor has shown promising potential to enable more compact design and smaller parasitics for inductor-based designs, such as voltage regulator, resonant clocking, filter, etc. On the other hand, conventional on-chip 2D spiral inductor must be placed on the top metal layers, thereby consuming significant routing resources for global interconnects. Moreover, it may need more dedicated shielding to prevent unnecessary coupling, which further increases its occupied area. With the popularity of 2.5D and 3D chip architecture, Through-Silicon-Via (TSV) has been widely used, a significant portion of which are placed for thermal/manufacturability/reliability purposes. Thus, those redundant TSVs can be utilized to form the on-chip inductor for 2.5D/3D chips, with lower footprint and higher inductance density compared from the conventional spiral inductor. Unlike prior works focusing on the inductor itself, this paper discusses the optimization and application of such TSV-inductor from system perspective, including the optimization options and its design considerations. The possible design options including physical parameters, architecture and materials, to optimize the TSV-inductor are thoroughly investigated. Based on that, we further study a few key design scenarios to evaluate the design impact with use of such TSV-inductor and provide the design guidelines for its application in actual system designs.

Parasitic Inductance Modeling for On-chip Interconnects Based on IC Analysis on Inductive Effects

Experimental Characterization of On-Chip Inductor and Capacitor Interconnect: Part II. Shunt Case

Modeling and Characterization of On‐Chip Interconnects

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

Design of Low Parasitic Inductance SiC MOSFETs Halfbridge Power Modules

TSV inductor optimization and its design implication

System-level Design Consideration and Optimization of Through-Silicon-via Inductor.

A derived circuit model for spiral inductors on lossy silicon substrate

Vertical Topologies of Miniature Multispiral Stacked Inductors

Equivalent Inductance Analysis and Quantification for PCB PDN Design

Neural-network-based parasitic modeling and extraction verification for RF/millimeter-wave integrated circuit design

Signal Integrity Analysis of Through-Silicon Via Based 3D Integrated Circuit

ON-CHIP INTERCONNECT SIMULATION OF PARASITIC CAPACITANCES IN PERIODIC STRUCTURES

An Accurate Interconnect Test Structure for Parasitic Validation in On-Chip Machine Learning Accelerators

Analysis of on-chip inductance effects for distributed RLC interconnects

Field-Based Parasitic Capacitance Models for 2d and 3d Sub-45-Nm Interconnect

Modeling and Design of Integrated Inductor and Transformer Considering Superposed Flux Density in On-Board-Charger

A parasitic extraction method of VLSI interconnects for pre-route timing analysis