Abstract:Based on several extended formulas to determine all frequency- and temperature-dependent distributed parameters of on-chip coupled asymmetrical and symmetrical interconnects on silicon substrates, the electromagnetic-thermal characteristics of interconnects were investigated in detail, including 1) wideband series impedances and shunt conductances, 2) conductive and dielectric attenuation constants of even(c) and odd (pi)-mode, 3) pulse waveform distortion and crosstalk, and 4) average power handling capability (APHC). In these investigations, a set of modified formulas were proposed to determine the mutual conductance and capacitance of asymmetrical configuration. Appropriate thermal models were employed to evaluate the rise in temperature of metal interconnects, where the lateral heat dissipation was taken into account for different spacings between two interconnects. Parametric calculations were performed to capture the hybrid effects of all geometric and physical parameters of metal interconnects, such as line thickness, line conductivity, and silicon conductivity. All numerical examples are believed to be useful in the design of (a)symmetrical interconnects for digital and radio frequency circuits.

Experimental Characterization of On-Chip Inductor and Capacitor Interconnect: Part II. Shunt Case

Parasitic Inductance Modeling for On-chip Interconnects Based on IC Analysis on Inductive Effects

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

Experimental Characterisation Of On-Chip Octagonal Double-Helix Inductors On Silicon Substrates

Experimental Characterisation and Modelling of On-Chip Capacitors and Resistors on GaAs Substrates

Modeling and Characterization of On‐Chip Interconnects

Experimental Characterization of Coupling Effects Between Two On-Chip Neighboring Square Inductors

Comparative Characteristics of On-Chip Single- and Double-Level Square Inductors

A Wideband Model for On-Chip Interconnects with Different Shielding Structures

Capacitance extraction of on-chip circular stacked inductors

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Transfer Functions of On-Chip Global Interconnects Based on Distributed RLCG Interconnects Model

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

Local scalable description of global characteristics of various on-chip asymmetrically octagonal inductors

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

Wideband Circuit Model of Silicon-Based Interconnects Up to 50 GHz

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

Comparative investigation on various on-chip center-tapped interleaved transformers: Research Articles

Comparative Investigation On Various On-Chip Center-Tapped Interleaved Transformers

An LC Resonant Method for the Accurate Extraction of Small Parasitic Resistance

Equivalent Circuit Model of On-Wafer Interconnects for Cmos Rfics