Abstract:On-chip coupled inductors express huge nonuniform coupling tendencies, especially as frequency increases. This though desirable for wireless/galvanically isolated signal transfer but when mixed with the ground-signal-ground (GSG) pad could lead to a misrepresentative of the device's true coupling performance. To determine the coupling between the coupled inductors and that of the GSG pad an integrator analytical model investigating the total coupling effects of the GSG pad on laterally-coupled and stacked inductors is presented in this study. The model characterizes the lateral and vertical coupling effects using lumped circuit elements with analytical equations. The coupling effects of each component are further decomposed and analyzed as electrical, magnetic, and combined effects. The electrical coupling effect, particularly that of the GSG pad, increases with frequency and impacts significantly on the coupled inductors and the substrate. The mm-wave frequency characteristics such as skin and proximity effects of the inductors are also modeled by the double RL ladder network. The parameter extraction of the model is based on the measured S-parameter data. The validation of the proposed model given the measured scattering parameter S-21 dB achieves an RMSE of 0.0132 dB at 50 GHz. The inductor typology is most applicable to two-port networks for impedance matching, cross-coupled VCOs, and high-speed communication networks.

Experimental Characterization of Coupling Effects Between Two On-Chip Neighboring Square Inductors

Comparative Characteristics of On-Chip Single- and Double-Level Square Inductors

Experimental Characterisation Of On-Chip Octagonal Double-Helix Inductors On Silicon Substrates

Local scalable description of global characteristics of various on-chip asymmetrically octagonal inductors

Global Performance Evaluation of Various On-Chip Square Spiral Inductors on Gaas Substrates

Experimental Characterization of On-Chip Inductor and Capacitor Interconnect: Part I. Series Case

Parasitic Inductance Modeling for On-chip Interconnects Based on IC Analysis on Inductive Effects

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Double-level Spiral Inductors with Multiple-Via Interconnects on GaAs Substrates

Experimental Characterization of On-Chip Single and Double-Coupling Spiral Inductors

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

Coupling Effects Between On-Chip Inductors in the Millimeter-Wave Regime

Modeling and Characterization of On‐Chip Interconnects

Characterization and Modeling of Multiple Coupled Inductors Based on On-Chip Four-Port Measurement

Capacitance extraction of on-chip circular stacked inductors

Model Description and Parameter Extraction of On-Chip Spiral Inductors for MMICs

Comparative Investigation On Various On-Chip Center-Tapped Interleaved Transformers

Electrical Characteristics and Behavioral Model of Spiral Inductors On Gaas Substrate

Comparative investigation on various on-chip center-tapped interleaved transformers: Research Articles

Analysis of On-Chip GSG Pads Coupling Effects on Laterally-Coupled and Double-Stacked Inductors in the Millimeter-Wave Frequency Regime

Multiple Coupling Inductors Model Based on Four-Port Measurement