Abstract:The challenge for accurate modeling of on-chip RE passive components, L/C/R, lies on the proper consideration of undesired parasities and capturing of distributed nature of the structure at high frequency. This is especially true for inductive components, namely inductors and transformers including baluns, because of the open capacitive and (long-range) magnetic couplings between the top widing metal layers and the lossy silicon substrate.This chapter is mostly focused on the equivalent circuit modeling (i.e., compact modeling) of spiral inductors and transformers, while the modeling of on-chip resistors and capacitors are briefly mentioned. Among the modeling of spirals inductive components, the emphasis is on the calculation and extraction of three key parameters: inductance L (and for transformers also the magnetic coupling coefficient k between the primary and secondary windings), quality factor Q, and self-resonant frequency SRF (due to inevitable parasitic capacitance across the port of the inductor). Both one-pi and two-pi circuit topologies for inductor modeling are reviewed with tilt toward the former because of its renaissance recently. The discussion on transformer modeling is largely based on the seminal work by Long (IEEE J. Solid-State Circuits 35(9): 1368, 2000). Up-to-date circuit applications of spiral transformers are provided as a motivation of studying this important subject.

A Derived Physically Expressive Circuit Model For Integrated Passives In Rfic

Quasi-Static Derived Physically Expressive Circuit Model for Lossy Integrated RF Passives

A derived circuit model for spiral inductors on lossy silicon substrate

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Equivalent Circuit Model of On-Wafer Interconnects for Cmos Rfics

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

An Improved RF MOSFET Model Accounting Substrate Coupling among Terminals

Wideband lumped element model for on-chip (a)symmetrical coupled interconnects on lossy silicon substrate

Electrothermal modeling of coaxial through silicon via (TSV) for three-dimensional ICs

RF CMOS is More Than CMOS: Modeling of RF Passive Components

Equivalent Circuit Model of On-Wafer CMOS Interconnects for RFICs.

Scalable Compact Circuit Model and Synthesis for RF CMOS Spiral Inductors

Passive-Assured Rational Function Approach For Compact Modeling Of On-Chip Passive Components

Scalable Compact Circuit Model for Differential Spiral Transformers in CMOS RFICs

Modeling of On-Chip Rf Passive Components

Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via

RF Equivalent‐circuit Model of Interconnect Bends Based on S‐parameter Measurements

A PEEC-Based Concise Broadband Physical Circuit Modeling Method with Parameter Extraction for PCB Inductive Components

Scalable Compact Modeling for On-Chip Passive Elements with Correlated Parameter Extraction and Adaptive Boundary Compression