A Low Power and Radiation-Tolerant Fpga Implemented in Fd Soi Process

Lihua Wu,Guoquan Zhang,Yan Zhao,Xiaowei Han,Bo Yang,Jianzhong Li,Jian Wang,Jiantou Gao,Kai Zhao,Ning Li,Fang Yu,Zhongli Liu
DOI: https://doi.org/10.1109/s3s.2013.6716566
2013-01-01
Abstract:A 330,000 gate field programmable gate array (FPGA) VS12C fabricated on 0.2μm full-depletion silicon-on-insulator (FD SOI) process is presented and the test results indicate this chip has the lower power and higher tolerance to radiation compared with Xilinx radiation-hardened XQVR300 chip implemented on 0.22μm epitaxial silicon. This paper demonstrates the benefit of the FD SOI technology on low power and radiation-tolerant FPGA circuit design.
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