All-Sputtered, Flexible, Bottom-Gate Igzo/Al2o3 Bi-Layer Thin Film Transistors on Pen Fabricated by A Fully Room Temperature Process
Zeke Zheng,Yong Zeng,Rihui Yao,Zhiqiang Fang,Hongke Zhang,Shiben Hu,Xiaoqing Li,Honglong Ning,Junbiao Peng,Weiguang Xie,Xubing Lu
DOI: https://doi.org/10.1039/c7tc02068f
IF: 6.4
2017-01-01
Journal of Materials Chemistry C
Abstract:In this work, an innovative all-sputtered bottom-gate thin film transistor (TFT) using an amorphous InGaZnO (IGZO)/Al2O3 bi-layer channel was fabricated by fully room temperature processes on a flexible PEN substrate. A bi-layer channel consisting of 10 nm-thick IGZO and 3 nm-thick Al2O3 was clearly observed in high resolution TEM images. The chemical structure of IGZO was dependent on different sputtering modes (pulse-DC/DC/RF), which were investigated by XPS measurements. The ultrathin Al2O3 layer on IGZO showed a significant effect on enhancing the mobility, reducing the off-state current, and improving the gate-bias stability. As a result, the IGZO/Al2O3 bi-layer TFT eventually exhibited a saturation mobility of 18.5 cm(2) V-1 s(-1), an I-on/I-off ratio of 10(7), an on-state voltage of 1.5 V and a subthreshold swing of 0.27 V decade(-1), as well as good stability under NBS/PBS and bending strain. The fabrication of this TFT can be suitably transferred to large-size arrays or paper-like substrates, which is in line with the trend of display development.