Sub-100 Nm Self-Aligned Top-Gate Amorphous InGaZnO Thin-Film Transistors with Gate Insulator of 4 Nm Atomic-Layer-Deposited AlOx

Yuqing Zhang,Jiye Li,Jinxiong Li,Tengyan Huang,Yuhang Guan,Yuhan Zhang,Huan Yang,Mansun Chan,Xinwei Wang,Lei Lu,Shengdong Zhang
DOI: https://doi.org/10.1109/led.2023.3237747
IF: 4.8157
2023-01-01
IEEE Electron Device Letters
Abstract:We herein demonstrate a self-aligned top-gate (SATG) coplanar amorphous InGaZnO (a-IGZO) thin-film transistor (TFT) technology, with the gate length ( ${L}_{\text {g}}$ ) down-scaled to 97 nm, and gate insulator (GI) AlOx to 4 nm (equivalent oxide thickness = 2.4 nm). The fabricated TFT exhibits a large on-current ( ${I} _{\text {ON}}$ ) of $17.9~\mu \text{A}/\mu \text{m}$ , a high on/off current ratio over 109, a positive threshold voltage ( ${V} _{\text {TH}}$ ) of 0.07 V, and a minimum drain-induced barrier lowering (DIBL) of 77 mV/V. The well-maintained performances of the TFTs even in the nanoscale regime can be ascribed to the abrupt homojunction at source-drain sides and high-quality of ultrathin gate insulator of AlOx by atomic layer deposition (ALD). With the excellent scaling metrics and compatibility with modern integrated circuit (IC) process, the developed SATG a-IGZO TFT technology is compatible with the back-end-of-line(BEOL) and 3D integrations of advanced ICs.
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