Mechanism of Leakage of Ion-Implantation Isolated AlGaN/GaN MIS-high Electron Mobility Transistors on Si Substrate
Zhili Zhang,Liang Song,Weiyi Li,Kai Fu,Guohao Yu,Xiaodong Zhang,Yaming Fan,Xuguang Deng,Shuiming Li,Shichuang Sun,Xiajun Li,Jie Yuan,Qian Sun,Zhihua Dong,Yong Cai,Baoshun Zhang
DOI: https://doi.org/10.1016/j.sse.2017.05.007
IF: 1.916
2017-01-01
Solid-State Electronics
Abstract:In this paper, we systematically investigated the leakage mechanism of the ion-implantation isolated AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MIS-HEMTs) on Si substrate. By means of combined DC tests at different temperatures and electric field dependence, we demonstrated the following original results: (1) It is proved that gate leakage is the main contribution to OFF-state leakage of ion-implantation isolated AlGaN/GaN MIS-HEMTs, and the gate leakage path is a series connection of the gate dielectric Si3N4 and Si3N4-GaN interface. (2) The dominant mechanisms of the leakage current through LPCVD-Si3N4 gate dielectric and Si3N4-GaN interface are identified to be Frenkel–Poole emission and two-dimensional variable range hopping (2D-VRH), respectively. (3) A certain temperature annealing could reduce the density of the interface state that produced by ion implantation, and consequently suppress the interface leakage transport, which results in a decrease in OFF-state leakage current of ion-implantation isolated AlGaN/GaN MIS-HEMTs.