Effects of AlN and AlGaN interlayer on properties of InAlN/GaN heterostructures

Xun Dong,Li Zhong-Hui,Li Zhe-Yang,Zhou Jian-Jun,Liang Li,Yun Li,Lan Zhang,Xu Xiao-Jun,Xuan Xu,Han Chun-Lin,董逊,李忠辉,李哲洋,周建军,李亮,李赟,张岚,许晓军,徐轩,韩春林
DOI: https://doi.org/10.1088/0256-307X/27/3/037102
2010-01-01
Chinese Physics Letters
Abstract:InAlN/GaN heterojunction structures are grown on two-inch c-face(0001) sapphire substrates by metalorganic chemical vapour deposition. AlN and AlGaN interlayers are intentionally inserted into the structure to improve the electrical properties. The lowest sheet resistance of 359 Omega/sq and the highest room-temperature two-dimensional electron gas (2DEG) mobility of 1051 cm(2) V-1 s(-1) is obtained in the structure with AlN thickness of 1.3 nm. The structure with AlN thickness of 2 nm exhibits the highest 2DEG concentration of 1.84 x 10(13) cm(-2). The sample with an AlGaN interlayer gives a smoother surface morphology compared to the one using an AlN interlayer, indicating potential applications of this technique in device fabrication.
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