Effects of AlN/GaN superlattice buffer layer on performances of AlGaN/GaN HEMT grown on silicon for sub-6 GHz applications

Le Trung Hieu,Heng-Tung Hsu,Chung-Han Chiang,Debashis Panda,Ching-Ting Lee,Edward Yi Chang,Chung-Hsiung Lin
DOI: https://doi.org/10.1088/1361-6641/acac4b
IF: 2.048
2022-12-18
Semiconductor Science and Technology
Abstract:In this study, the effects of AlN/GaN superlattice (SL) thickness on performances of AlGaN/GaN high electron mobility transistor (HEMT) heterostructure grown by metal-organic chemical vapor deposition (MOCVD) on silicon is investigated. Stress in GaN is controlled by varying the total thickness of the AlN/GaN SL. Improved crystal quality and surface roughness accomplished with 2200 nm-thick AlN/GaN SL, leads to an increase in high electron mobility (1760 cm2/V·s) as well as two-dimensional electron gas (2DEG) concentration (1.04×1013 cm-2). AlGaN/GaN metal-insulator-semiconductor HEMT (MIS-HEMT) fabricated on the heterostructure with SL buffer layer exhibits a significant improvement in maximum saturation current of 1100±29 mA/mm at VGS = 0 V and a low on-resistance (RON) of 4.3±0.15 Ω·mm for the optimized AlN/GaN SL. The 2200 nm-thick AlN/GaN SL supports the growth of stress-free GaN heterostructure, which can reduce the insertion loss for sub-6 GHz RF applications. This GaN HEMT structure based on superlattice buffer layer is suitable for low-frequency RF power applications.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter
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