Abstract:Tungsten carbide (WC), celebrated for its exceptional strength, hardness, and chemical inertness, serves as an exemplary reinforcement for copper (Cu) matrix composite (CMC) coatings, significantly enhancing their wear and corrosion resistance. However, the inherent poor wettability and interfacial bonding between WC and Cu during the cold spray additive manufacturing process pose challenges to further performance improvement of these coatings. This study investigates cold-sprayed CMC coatings reinforced with WC particles, both with and without an electroless plated cobalt (Co) shell (Co@WC; at 10 wt.% and 20 wt.%), focusing on their microstructure, mechanical properties, tribological behavior, and electrochemical corrosion resistance. The findings indicate a reduction in CMC coatings` porosity and mean free path (MFP) of reinforcement particles with increasing reinforcement content. Despite slight Co shell damage during deposition, ceramic retention is notably enhanced, reaching up to 149.3%. The microhardness and wear resistance of CMC coating are improved with decreased MFP and increased ceramic content. Compared to the Cu coating, the microhardness of CMC coatings escalates by up to 32.9% (151.8HV0.1), and the specific wear rate is dramatically reduced by up to 84.2%. The Co shell effectively prevents the detachment of Co@WC particles, thereby enhancing the bending and wear resistance. Electrochemical corrosion tests, encompassing open circuit potential (EOCP), polarization curve, and electrochemical impedance spectroscopy (EIS), indicate that lower porosity, high ceramic content and the Co shell substantially boost the corrosion resistance of the CMC coating. Specifically, the coating with 20 wt.% Co@WC (Cu20(Co@WC)) demonstrates superior corrosion resistance compared to the Cu coating, hinting at the potential for further enhancement with increased ceramic content.

Tungsten Carbides As a Diffusion Barrier for Cu Metallization

Influences of Ni/Cu/Cr3C2 Composite Additive on Microstructure and Properties of WC–10Co Fine Grained Hardmetal

The Effect of Sputtered W-based Carbide Diffusion Barriers on the Thermal Stability and Void Formation in Copper Thin Films

Enhanced the Mechanical Properties and Corrosion Resistance of Ultra-Coarse Grain WC-8Co Cemented Carbides by the Introduction of Cu and Ni

Diffusion Barrier Performance of W/Ta-W-N Double Layers for Cu Metallization

Improvement of Diffusion Barrier Performance of Ru Thin Film by Incorporating a WHfN Underlayer for Cu Metallization

Nano-grained ZrB2 Thin Films As a High-Performance Diffusion Barrier in Cu Metallization

Application of Zr-Si Film As Diffusion Barrier in Cu Metallization

Resistivity of Cu-Zr/ZrN diffusion barrier films

Characterization of Thermal Stability of RuMoC Films as Seedless Cu Diffusion Barriers in Damascene Structures for Cu Interconnects

Influence of copper sputtering on thermal stability of ZrN diffusion barrier

Interfacial Reaction of W/Cu Examined by an N-Body Potential Through Molecular Dynamics Simulations

Cold-sprayed Cu Matrix Composite Coatings with Core-Shell Structured Co@WC Reinforcements on Q235 Steel

Thermal Stability of Ultrathin RuC Film As Cu Diffusion Barrier

Thermally stable Mo-Co-B thin film metallic glass as a potential diffusion barrier in Cu/Si contact system

Performance Improved by Incorporating of Ru Atoms into Zr-Si Diffusion Barrier for Cu Metallization

Thermal Performance of Sputtered Cu Films Containing Insoluble Zr and Cr for Advanced Barrierless Cu Metallization

First-principles investigation of Cu/Ti-TM/Si (TM=W, Ru) interfaces: Role of Ti-TM binary alloys as diffusion barrier layers

Evaluation of Cu(V) Self-Forming Barrier for Cu Metallization

Diffusion Barrier Performance of Reactively Sputtered Ta–W–N Between Cu and Si

First-principles investigation of hydrogen interaction with Cu/WC interface